SLLSFL8A July   2021  – December 2021 TCAN1046AV-Q1 , TCAN1048AV-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description Continued
  6. 6 Device Comparison
  7. 7 Pin Configuration and Functions
  8. 8 Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  ESD Ratings — IEC Specifications
    4. 8.4  Recommended Operating Conditions
    5. 8.5  Thermal Characteristics
    6. 8.6  Supply Characteristics
    7. 8.7  Dissipation Ratings
    8. 8.8  Electrical Characteristics
    9. 8.9  Switching Characteristics
    10. 8.10 Typical Characteristics
  9. 9 Parameter Measurement Information
  10. 10Detailed Description
    1. 10.1 Overview
    2. 10.2 Functional Block Diagram
    3. 10.3 Feature Description
      1. 10.3.1 Pin Description
        1. 10.3.1.1 TXD1 and TXD2
        2. 10.3.1.2 GND1 and GND2
        3. 10.3.1.3 VCC
        4. 10.3.1.4 RXD1 and RXD2
        5. 10.3.1.5 VIO
        6. 10.3.1.6 CANH and CANL
        7. 10.3.1.7 STB1, STB2, nSTB1, and nSTB2 (Standby)
      2. 10.3.2 CAN Bus States
      3. 10.3.3 TXD Dominant Timeout (DTO)
      4. 10.3.4 CAN Bus Short Circuit Current Limiting
      5. 10.3.5 Thermal Shutdown (TSD)
      6. 10.3.6 Undervoltage Lockout
      7. 10.3.7 Unpowered Device
      8. 10.3.8 Floating pins
    4. 10.4 Device Functional Modes
      1. 10.4.1 Operating Modes
      2. 10.4.2 Normal Mode
      3. 10.4.3 Standby Mode
        1. 10.4.3.1 Remote Wake Request via Wake-Up Pattern (WUP) in Standby Mode
      4. 10.4.4 Driver and Receiver Function
  11. 11Application and Implementation
    1. 11.1 Application Information
    2. 11.2 Typical Application
      1. 11.2.1 Design Requirements
        1. 11.2.1.1 CAN Termination
      2. 11.2.2 Detailed Design Procedures
        1. 11.2.2.1 Bus Loading, Length and Number of Nodes
      3. 11.2.3 Application Curves
    3. 11.3 System Examples
  12. 12Power Supply Recommendations
  13. 13Layout
    1. 13.1 Layout Guidelines
    2. 13.2 Layout Example
  14. 14Device and Documentation Support
    1. 14.1 Receiving Notification of Documentation Updates
    2. 14.2 Support Resources
    3. 14.3 Trademarks
    4. 14.4 Electrostatic Discharge Caution
    5. 14.5 Glossary
  15. 15Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Pin Configuration and Functions

Figure 7-1 D Package, 14 Pin SOIC, Top View
Figure 7-3 DMT Package, 14 Pin VSON, Top View
GUID-20210629-CA0I-PNPF-BG41-ZDZ7LKRZ1NXT-low.pngFigure 7-2 DYY Package, 14 Pin SOT-23, Top View
Table 7-1 Pin Functions
PinsTypeDescription
NameNo.
TXD11Digital InputCAN transmit data input channel 1; integrated pull-up
GND12GNDGround connection
VCC3Supply5-V supply voltage
RXD14Digital OutputCAN receive data output channel 1; tri-state when VIO < UVVIO
GND25GNDGround connection
TXD26Digital InputCAN transmit data input channel 2; integrated pull-up
RXD27Digital OutputCAN receive data output channel 2; tri-state when VIO < UVVIO
STB28Digital InputStandby input of channel 2 for mode control; integrated pull-up (TCAN1046AV–Q1)
nSTB2Standby input of channel 2 for mode control; inverse logic with integrated pull-down (TCAN1048AV–Q1)
CANL29Bus IOLow-level CAN bus channel 2 input/output line
CANH210Bus IOHigh-level CAN bus channel 2 input/output line
VIO11SupplyI/O supply voltage
CANL112Bus IOLow-level CAN bus channel 1 input/output line
CANH113Bus IOHigh-level CAN bus channel 1 input/output line
STB114Digital InputStandby input of channel 1 for mode control; integrated pull-up (TCAN1046AV–Q1)
nSTB1Standby input of channel 1 for mode control; inverse logic with integrated pull-down (TCAN1048AV–Q1)
Thermal Pad (VSON only)—Connect the thermal pad to the printed circuit board (PCB) ground plane for thermal relief