SNLS787 September   2025 TDP2004-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 DC Electrical Characteristics
    6. 5.6 High Speed Electrical Characteristics
    7. 5.7 SMBUS/I2C Timing Charateristics
    8. 5.8 Typical Characteristics
    9. 5.9 Typical Jitter Characteristics
  7. 6Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 RX Equalization Control Settings
      2. 6.3.2 Flat-Gain
      3. 6.3.3 Cross Point
    4. 6.4 Device Functional Modes
      1. 6.4.1 Active Mode
      2. 6.4.2 Standby Mode
    5. 6.5 Programming
      1. 6.5.1 Pin mode
        1. 6.5.1.1 Five-Level Control Inputs
      2. 6.5.2 SMBUS/I2C Register Control Interface
        1. 6.5.2.1 Shared Registers
        2. 6.5.2.2 Channel Registers
      3. 6.5.3 SMBus/I2C Controller Mode Configuration (EEPROM Self Load)
  8. 7Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 DP2.1 Main Link Signal Conditioning
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 USB-C Cross Point Mux with Signal Conditioner
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.