SLDS145D October   2001  – February 2024 TFP410

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 T.M.D.S. Pixel Data and Control Signal Encoding
      2. 6.3.2 Universal Graphics Controller Interface Voltage Signal Levels
      3. 6.3.3 Universal Graphics Controller Interface Clock Inputs
    4. 6.4 Device Functional Modes
      1. 6.4.1 Universal Graphics Controller Interface Modes
      2. 6.4.2 Data De-skew Feature
      3. 6.4.3 Hot Plug/Unplug (Auto Connect/Disconnect Detection)
      4. 6.4.4 Device Configuration and I2C RESET Description
      5. 6.4.5 DE Generator
    5. 6.5 Programming
      1. 6.5.1 I2C Interface
    6. 6.6 Register Maps
      1. 6.6.1  VEN_ID Register (Sub-Address = 01−00 ) [reset = 0x014C]
      2. 6.6.2  DEV_ID Register (Sub-Address = 03–02) [reset = 0x0410]
      3. 6.6.3  REV_ID Register (Sub-Address = 04) [reset = 0x00]
      4. 6.6.4  Reserved Register (Sub-Address = 07–05) [reset = 0x641400]
      5. 6.6.5  CTL_1_MODE (Sub-Address = 08) [reset = 0xBE]
      6. 6.6.6  CTL_2_MODE Register (Sub-Address = 09) [reset = 0x00]
      7. 6.6.7  CTL_3_MODE Register (Sub-Address = 0A) [reset = 0x80]
      8. 6.6.8  CFG Register (Sub-Address = 0B)
      9. 6.6.9  RESERVED Register (Sub-Address = 0E–0C) [reset = 0x97D0A9]
      10. 6.6.10 DE_DLY Register (Sub-Address = 32) [reset = 0x00]
      11. 6.6.11 DE_CTL Register (Sub-Address = 33) [reset = 0x00]
      12. 6.6.12 DE_TOP Register (Sub-Address = 34) [reset = 0x00]
      13. 6.6.13 DE_CNT Register (Sub-Address = 37–36) [reset = 0x0000]
      14. 6.6.14 DE_LIN Register (Sub-Address = 39–38) [reset = 0x0000]
      15. 6.6.15 H_RES Register (Sub-Address = 3B−3A)
      16. 6.6.16 V_RES Register (Sub-Address = 3D−3C)
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Data and Control Signals
        2. 7.2.2.2 Configuration Options
        3. 7.2.2.3 Power Supplies Decoupling
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
      1. 7.3.1 DVDD
      2. 7.3.2 TVDD
      3. 7.3.3 PVDD
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Layer Stack
        2. 7.4.1.2 Routing High-Speed Differential Signal Traces (RxC-, RxC+, Rx0-, Rx0+, Rx1-, Rx1+, Rx2-, Rx2+)
        3. 7.4.1.3 DVI Connector
      2. 7.4.2 Layout Example
      3. 7.4.3 TI PowerPAD 64-Pin HTQFP Package
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PAP|64
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Electrical Characteristics

over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC SPECIFICATIONS
VIH High-level input voltage (Data, DE, VSYNC, HSYNC, and IDCK+/- CMOS inputs) VREF = DVDD 0.7VDD V
0.5V ≤ V ≤ 0.95V VREF + 0.2
High-level input voltage (all other CMOS inputs) 0.7VDD
VIL Low-level input voltage (Data, DE, VSYNC, HSYNC, and IDCK+/- CMOS inputs) VREF = DVDD 0.3VDD V
0.5V ≤V ≤ 0.95V VREF – 0.2
Low-level input voltage (all other CMOS inputs) 0.3VDD
VOH High-level digital output voltage (open-drain output) VDD = 3V, IOH = 20μA 2.4 V
VOL Low-level digital output voltage (open-drain output) VDD = 3.6V, IOL = 4mA 0.4 V
IIH High-level input current VI = 3.6V ±25 µA
IIL Low-level input current VI = 0 ±25 µA
VH DVI single-ended high-level output voltage AVDD = 3.3V ± 5%,
RT(1) = 50Ω ± 10%,
RTFADJ = 510Ω ± 1%		 AVDD – 0.01 AVDD + 0.01 V
VL DVI single-ended low-level output voltage AVDD – 0.6 AVDD – 0.4 V
VSWING DVI single-ended output swing voltage 400 600 mVP-P
VOFF DVI single-ended standby/off output voltage AVDD – 0.01 AVDD + 0.01 V
IPD Power-down current(3) 200 500 µA
IIDD Normal power supply current Worst-case pattern(2) 200 250 mA
AC SPECIFICATIONS
f(IDCK) IDCK frequency 25 165 MHz
tr DVI output rise time (20-80%)(4) f(IDCK) = 165MHz 75 240 ps
tf DVI output fall time (20-80%)(4) 75 240 ps
tsk(D) DVI output intra-pair + to − differential skew(5), see Figure 5-4 50 ps
tojit DVI output clock jitter, max.(6) 150 ps
t(STEP) De-skew trim increment DKEN = 1 350 ps
(1) RT is the single-ended termination resistance at the receiver end of the DVI link
(2) Black and white checkerboard pattern, each checker is one pixel wide.
(3) Assumes all inputs to the transmitter are not toggling.
(4) Rise and fall times are measured as the time between 20% and 80% of signal amplitude.
(5) Measured differentially at the 50% crossing point using the IDCK+ input clock as a trigger.
(6) Relative to input clock (IDCK).