SLOSE89A November   2021  – March 2022 THS4541-DIE

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Bare Die Information
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Electrical Characteristics: (Vs+) - Vs- = 5 V
    4. 7.4 Typical Characteristics 5-V Single Supply
    5. 7.5 Typical Characteristics: 3-V to 5-V Supply Range
  8. 8 Detailed Description
    1. 8.1 Overview
      1. 8.1.1 Terminology and Application Assumptions
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Differential I/O
      2. 8.3.2 Power-Down Control Pin (PD)
        1. 8.3.2.1 Operating the Power Shutdown Feature
      3. 8.3.3 Input Overdrive Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Operation from Single-Ended Sources to Differential Outputs
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Interfacing to High-Performance ADCs
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 TINA Simulation Model Features
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • Y|0
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Description

The THS4541-DIE is a low-power, voltage-feedback, fully differential amplifier (FDA) with an input common-mode range below the negative rail, and rail-to-rail output. This is a bare die product that can be used in multi-chip modules (MCM), system-in-package (SiP), chip-on-board (COB), hybrids, and systems that require an extremely small size. The THS4541-DIE is designed for low-power data acquisition systems where high density is critical in a high-performance analog-to-digital converter (ADC) or digital-to-analog converter (DAC) interface design.

The THS4541-DIE features the negative-rail input required when interfacing a DC-coupled, ground-centered, source signal. This negative-rail input, with rail-to-rail output, allows for easy interface between single-ended, ground-referenced, bipolar signal sources and a wide variety of successive approximation register (SAR), delta-sigma (ΔΣ), or pipeline ADCs using only a single 2.7 V to 5.4 V power supply.

Device Information(1)
PART NUMBER PACKAGE DIE SIZE
THS4541-DIE Bare die in tape and reel 1198 µm × 1006 µm
(1) For all available packages, see the package option addendum at the end of the data sheet.
GUID-20210511-CA0I-PC10-8X32-QWK9HTPHGNNR-low.gifSimplified Schematic
GUID-22607121-2C17-42C3-A4D2-D7FA38DB3068-low.gifSingle to Differental Gain of 2, 2-V Output