SBOS643A April   2014  – May 2014 THS6226A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: VS = +12 V
    6. 6.6 Timing Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High Output Current Line Driver
      2. 7.3.2 Charge Pump
      3. 7.3.3 Voltage Reference
      4. 7.3.4 Logic
      5. 7.3.5 Active Impedance
      6. 7.3.6 RESET Pin
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 Programming the Device
      2. 7.5.2 Quiescent Current
  8. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Initialization Set Up
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

RHB Package(1)(2)12
VQFN-32
(Top View)
po_bos593.gif
1. The PowerPAD is electrically isolated from all other pins and can be connected to any potential voltage range from VS– to VS+. Typically, the PowerPAD is connected to the GND plane because this plane tends to physically be the largest and is able to dissipate the most amount of heat.
2. The device defaults to the disabled mode at power-up.
3. Default is GND (internal pull-down resistor).

Pin Functions

PIN I/O DESCRIPTION
NO. NAME
1, 12, 29 GND — Analog ground
2 IND I Input D of amplifier CD
3 INC I Input C of amplifier CD
4 DATA I Serial interface data pin
5 CLK I Serial interface CLK pin
6 INB I Input B of amplifier AB
7 INA I Input A of amplifier AB
8 RESET I Reset the internal register to 00h (startup conditions, state machine may require resetting)
9 VH_ENAB I Class H mode control pin for amplifier AB
10 VLL_AB — Amplifier AB low pump supply
11 CAPL_AB — Amplifier AB negative voltage pump capacitor pin
13, 14 VSAB — Amplifier AB supply voltage
15 CAPH_AB — Amplifier AB positive voltage pump capacitor pin
16 VHH_AB — Amplifier AB high pump supply
17 OUTA O Output A of amplifier AB
18 FB_A I Feedback for active output impedance of amplifier AB
19 FB_B I Feedback for active output impedance of amplifier AB
20 OUTB O Output B of amplifier AB
21 OUTC O Output C of amplifier CD
22 FB_C I Feedback for active output impedance of amplifier CD
23 FB_D I Feedback for active output impedance of amplifier CD
24 OUTD O Output D of amplifier CD
25 VHH_CD — Amplifier CD high pump supply
26 CAPH_CD — Amplifier CD positive voltage pump capacitor pin
27, 28 VSCD — Amplifier CD supply voltage
30 CAPL_CD — Amplifier CD negative voltage pump capacitor pin
31 VLL_CD — Amplifier CD low pump supply
32 VH_ENCD I Class H mode control pin for amplifier CD
PowerPAD — The PowerPAD must be connected to any internal PCB ground plane using multiple vias for good thermal performance.