SLOS080V september   1978  – april 2023 TL071 , TL071A , TL071B , TL071H , TL072 , TL072A , TL072B , TL072H , TL072M , TL074 , TL074A , TL074B , TL074H , TL074M

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information for Single Channel
    5. 6.5  Thermal Information for Dual Channel
    6. 6.6  Thermal Information for Quad Channel
    7. 6.7  Electrical Characteristics: TL07xH
    8. 6.8  Electrical Characteristics (DC): TL07xC, TL07xAC, TL07xBC, TL07xI, TL07xM
    9. 6.9  Electrical Characteristics (AC): TL07xC, TL07xAC, TL07xBC, TL07xI, TL07xM
    10. 6.10 Typical Characteristics: TL07xH
    11. 6.11 Typical Characteristics: All Devices Except TL07xH
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Total Harmonic Distortion
      2. 8.3.2 Slew Rate
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Unity Gain Buffer
      1. 9.3.1 Design Requirements
      2. 9.3.2 Detailed Design Procedure
      3. 9.3.3 Application Curves
    4. 9.4 System Examples
    5. 9.5 Power Supply Recommendations
    6. 9.6 Layout
      1. 9.6.1 Layout Guidelines
      2. 9.6.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision U (December 2022) to Revision V (April 2023)

  • Updated Overview, Functional Block Diagram, and Feature Description sections Go

Changes from Revision T (December 2021) to Revision U (December 2022)

  • Changed Absolute Maximum Ratings, ESD Ratings, Recommended Operating Conditions, and Thermal Information sections by merging TL07xH and TL07xx specificationsGo
  • Changed Electrical Characteristics  tables by merging TL07xC, TL07xAC, TL07xBC, TL07xI, and TL07xM specificationsGo
  • Changed gain bandwidth value of all non-NS/non-PS packages and non-TL07xM devices from 3 MHz to 5.25 MHzGo
  • Changed TL07xC, TL07xAC, TL07xBC, TL07xI, and TL07xM Switching Characteristics tables by renaming to Electrical Characteristics (AC) Go
  • Changed input voltage noise density at 1 kHz for all non-PS/non-NS packages and all non-TL07xM devices to 37 nV/√Hz Go
  • Changed THD+N for all non-PS/non-NS packages and all non-TL07xM devices to 0.00012%Go

Changes from Revision S (July 2021) to Revision T (December 2021)

  • Corrected DCK pinout diagram and table in Pin Configurations and Functions sectionGo

Changes from Revision R (June 2021) to Revision S (July 2021)

  • Deleted preview note from TL071H SOIC (8), SOT-23 (5) and SC70 (5) packages throughout the data sheetGo

Changes from Revision Q (June 2021) to Revision R (June 2021)

  • Deleted preview note from TL072H SOIC (8), SOT-23 (8) and TSSOP (8) packages throughout the data sheetGo
  • Added ESD information for TL072HGo
  • Added IQ spec for TL072HGo

Changes from Revision P (November 2020) to Revision Q (June 2021)

  • Deleted VSSOP (8) package from the Device Information sectionGo
  • Added DBV, DCK, and D Package,s to TL071H in Pin Configuration and Functions sectionGo
  • Deleted DGK Package, from TL072x in Pin Configuration and Functions sectionGo
  • Deleted tables with duplicate information from the Specifications sectionGo
  • Added  D, DCK, and DBV package thermal information in Thermal Information for Single Channel: TL071H sectionGo
  • Added D, DDF, and PW package thermal information in Thermal Information for Dual Channel: TL072H sectionGo
  • Added IB and IOS specification for single channel DCK and DBV packageGo
  • Added IQ spec for TL071HGo
  • Deleted Related Links section from the Device and Documentation Support sectionGo

Changes from Revision O (October 2020) to Revision P (November 2020)

  • Added SOIC and TSSOP package thermal information in Thermal Information for Quad Channel: TL074H section Go
  • Added Typical Characteristics:TL07xH section in Specifications sectionGo

Changes from Revision N (July 2017) to Revision O (October 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Features of TL07xH added to the Features sectionGo
  • Added link to applications in the Applications sectionGo
  • Added TL07xH in the Description sectionGo
  • Added TL07xH device in the Device Information sectionGo
  • Added SOT-23 (14), VSSOP (8), SOT-23 (8), SC70 (5), and SOT-23 (5) packages to the Device Information sectionGo
  • Added TSSOP, VSSOP and DDF Package,s to TL072x in Pin Configuration and Functions sectionGo
  • Added DYY Package, to TL074x in Pin Configuration and Functions sectionGo
  • Removed Table of Graphs from the Typical Characteistics sectionGo
  • Deleted reference to obsolete documentation in Layout Guidelines sectionGo
  • Removed Related Documentation sectionGo

Changes from Revision M (February 2014) to Revision N (July 2017)

  • Updated data sheet text to latest documentation and translation standardsGo
  • Added TL072M and TL074M devices to data sheet Go
  • Rewrote text in Description section Go
  • Changed TL07x 8-pin PDIP package to 8-pin CDIP package in Device Information table Go
  • Deleted 20-pin LCCC package from Device Information table Go
  • Added 2017 copyright statement to front page schematicGo
  • Deleted TL071x FK (LCCC) pinout drawing and pinout table in Pin Configurations and Functions section Go
  • Updated pinout diagrams and pinout tables in Pin Configurations and Functions section Go
  • Added Figure 6-59 to Typical Characteristics sectionGo
  • Added second Typical Application section application curves Go
  • Changed document references in Layout Guidelines section Go

Changes from Revision L (February 2014) to Revision M (February 2014)

  • Added Device Information table, Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout sectionGo