SGLS199C January   2004  – July 2025 TLE2021-Q1 , TLE2021A-Q1 , TLE2022-Q1 , TLE2022A-Q1 , TLE2024-Q1

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  Recommended Operating Conditions
    3. 5.3  Thermal Information for TLE2021-Q1
    4. 5.4  Thermal Information for TLE2022-Q1
    5. 5.5  Thermal Information for TLE2024-Q1
    6. 5.6  Electrical Characteristics for TLE2021-Q1, VCC = ±15V
    7. 5.7  Electrical Characteristics for TLE2021-Q1, VCC = 5V
    8. 5.8  Electrical Characteristics for TLE2022-Q1, VCC = ±15V
    9. 5.9  Electrical Characteristics for TLE2022-Q1, VCC = 5V
    10. 5.10 Electrical Characteristics for TLE2024-Q1, VCC = ±15V
    11. 5.11 Electrical Characteristics for TLE2024-Q1, VCC = 5V
    12. 5.12 Typical Characteristics
  7. 6Application and Implementation
    1. 6.1 Application Information
      1. 6.1.1 Voltage-Follower Applications
      2. 6.1.2 Input Offset Voltage Null
    2. 6.2 Layout
      1. 6.2.1 Layout Guidelines
      2. 6.2.2 Layout Example
  8. 7Device and Documentation Support
    1. 7.1 Receiving Notification of Documentation Updates
    2. 7.2 Support Resources
    3. 7.3 Trademarks
    4. 7.4 Electrostatic Discharge Caution
    5. 7.5 Glossary
  9. 8Revision History
  10. 9Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information for TLE2022-Q1

THERMAL METRIC(1) TLE2022-Q1 UNIT
D (SOIC)
8 PINS
RθJA Junction-to-ambient thermal resistance 122.4 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 61.5 °C/W
RθJB Junction-to-board thermal resistance 70.0 °C/W
ψJT Junction-to-top characterization parameter 11.2 °C/W
ψJB Junction-to-board characterization parameter 69.1 °C/W
RθJC(bot) Junction-to-case(bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.