SLVSJD7 February   1997  – July 2025 TLE2021 , TLE2021A , TLE2021M , TLE2022 , TLE2022A , TLE2022AM , TLE2022M , TLE2024 , TLE2024A , TLE2024B , TLE2024BM

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Tables
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Recommended Operating Conditions
    3. 6.3  Thermal Information for TLE2021
    4. 6.4  Thermal Information for TLE2022
    5. 6.5  Thermal Information for TLE2024
    6. 6.6  Electrical Characteristics for TLE2021, VCC = ±15V
    7. 6.7  Electrical Characteristics for TLE2021, VCC = 5V
    8. 6.8  Electrical Characteristics for TLE2022, VCC = ±15V
    9. 6.9  Electrical Characteristics for TLE2022, VCC = 5V
    10. 6.10 Electrical Characteristics for TLE2024, VCC = ±15V
    11. 6.11 Electrical Characteristics for TLE2024, VCC = 5V
    12. 6.12 Typical Characteristics
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Voltage-Follower Applications
      2. 7.1.2 Input Offset Voltage Null
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
  • N|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.5 Electrostatic Discharge Caution

TLE2021 TLE2021A TLE2021M TLE2022 TLE2022A TLE2022AM TLE2022B TLE2022M TLE2024 TLE2024A TLE2024B TLE2024BM This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.