SLVSJD7 February   1997  – July 2025 TLE2021 , TLE2021A , TLE2021M , TLE2022 , TLE2022A , TLE2022AM , TLE2022M , TLE2024 , TLE2024A , TLE2024B , TLE2024BM

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Tables
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Recommended Operating Conditions
    3. 6.3  Thermal Information for TLE2021
    4. 6.4  Thermal Information for TLE2022
    5. 6.5  Thermal Information for TLE2024
    6. 6.6  Electrical Characteristics for TLE2021, VCC = ±15V
    7. 6.7  Electrical Characteristics for TLE2021, VCC = 5V
    8. 6.8  Electrical Characteristics for TLE2022, VCC = ±15V
    9. 6.9  Electrical Characteristics for TLE2022, VCC = 5V
    10. 6.10 Electrical Characteristics for TLE2024, VCC = ±15V
    11. 6.11 Electrical Characteristics for TLE2024, VCC = 5V
    12. 6.12 Typical Characteristics
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Voltage-Follower Applications
      2. 7.1.2 Input Offset Voltage Null
    2. 7.2 Layout
      1. 7.2.1 Layout Guidelines
      2. 7.2.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DW|16
  • N|14
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.