SNOSDC8E September   2022  – July 2025 TLV1811 , TLV1812 , TLV1814 , TLV1821 , TLV1822 , TLV1824

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1.     Pin Functions:TLV18x1 TLV18x1L
    2.     Pin Functions:TLV1812 and TLV1822
    3.     Pin Functions: TLV1814 and TLV1824
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - Single
    5. 5.5 Thermal Information - Dual
    6. 5.6 Thermal Information - Quad
    7. 5.7 Electrical Characteristics
    8. 5.8 Switching Characteristics
  7. 6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Inputs
        1. 7.4.1.1 TLV18xx Rail-to-Rail Input
        2. 7.4.1.2 ESD Protection
        3. 7.4.1.3 Unused Inputs
      2. 7.4.2 Outputs
        1. 7.4.2.1 TLV181x Push-Pull Output
        2. 7.4.2.2 TLV182x Open-Drain Output
      3. 7.4.3 Power-On Reset (POR)
      4. 7.4.4 Hysteresis
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Comparator Definitions
        1. 8.1.1.1 Operation
        2. 8.1.1.2 Propagation Delay
        3. 8.1.1.3 Overdrive and Underdrive Voltage
      2. 8.1.2 Hysteresis
        1. 8.1.2.1 Inverting Comparator With Hysteresis
        2. 8.1.2.2 Non-Inverting Comparator With Hysteresis
        3. 8.1.2.3 Inverting and Non-Inverting Hysteresis using Open-Drain Output
    2. 8.2 Typical Applications
      1. 8.2.1 Window Comparator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Square-Wave Oscillator
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
      3. 8.2.3 Adjustable Pulse Width Generator
      4. 8.2.4 Time Delay Generator
      5. 8.2.5 Logic Level Shifter
      6. 8.2.6 One-Shot Multivibrator
      7. 8.2.7 Bi-Stable Multivibrator
      8. 8.2.8 Zero Crossing Detector
      9. 8.2.9 Pulse Slicer
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Thermal Information - Quad

THERMAL METRIC(1) TLV18x4 UNIT
D (SOIC) PW (TSSOP) DYY (SOT-23-THN) RTE (WQFN)
16 PINS 16 PINS 16 PINS 16 PINS
RθJA Junction-to-ambient thermal resistance 104.2 124.1 119.9 53.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 60.3 52.4 60.6 58.6 °C/W
RθJB Junction-to-board thermal resistance 60.2 67.2 79.0 29.0 °C/W
ψJT Junction-to-top characterization parameter 20.7 7.5 3.3 2.2 °C/W
ψJB Junction-to-board characterization parameter 59.8 66.6 41.2 28.9 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance – – – 13.1 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.