SGLS349A october   2006  – may 2023 TLV3011-EP , TLV3012-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings - TLV3011-EP
    2. 6.2  Absolute Maximum Ratings - TLV3012-EP
    3. 6.3  ESD Ratings
    4. 6.4  Thermal Resistance Characteristics
    5. 6.5  Recommended Operating Conditions - TLV3011-EP
    6. 6.6  Recommended Operating Conditions - TLV3012-EP
    7. 6.7  Electrical Characteristics - TLV3011-EP
    8. 6.8  Electrical Characteristics - TLV3012-EP
    9. 6.9  Switching Characteristics - TLV3012-EP
    10. 6.10 Typical Characteristics - TLV3011-EP
    11. 6.11 Typical Characteristics - TLV3012-EP
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Open Drain Output (TLV3011-EP)
      2. 7.4.2 Push Pull Output (TLV3012-EP)
      3. 7.4.3 Voltage Reference
      4. 7.4.4 Fail-Safe Input (TLV3012-EP Only)
      5. 7.4.5 Power-On Reset (POR) (TLV3012-EP Only)
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 External Hysteresis
    2. 8.2 Typical Application
      1. 8.2.1 Under Voltage Detection
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Resistance Characteristics

THERMAL METRIC1TLV3011-EP

TLV3012-EP

UNIT
DBV
(SOT-23)

DBV
(SOT-23)

6 PINS

6 PINS

R θJAJunction-to-ambient thermal resistance

191.9

162.5

°C/W
R θJC(top)Junction-to-case (top) thermal resistance

123.9

78.8

°C/W
R θJBJunction-to-board thermal resistance

38.7

42.1

°C/W
ψ JTJunction-to-top characterization parameter

21.2

21.2

°C/W
ψ JBJunction-to-board characterization parameter

38.2

41.9

°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics report.