SNOSDF4A October 2022 – December 2023 TLV3801-Q1 , TLV3802-Q1
PRODMIX
- 1
- 1 Features
- 2 Applications
- 3 Description
- 4 Revision History
- 5 Pin Configuration and Functions
- 6 Specifications
- 7 Detailed Description
- 8 Application and Implementation
- 9 Device and Documentation Support
- 10Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
- DSG|8
Thermal pad, mechanical data (Package|Pins)
- DSG|8
Orderable Information
6.7 Typical Characteristics
At TA = 25°C, VCC - VEE = 3.3 V to 5 V while VEE = GND = 0, VCM = 2.5 V, and input overdrive/underdrive = 50 mV, unless otherwise noted.
Figure 6-3 Offset vs. Temperature
Figure 6-5 Offset vs. Common-Mode, 3.3 V
Figure 6-7 Offset vs. Common-Mode, 5 V
Figure 6-9 Supply Current vs. Temperature, Output
Low
Figure 6-11 Bias Current vs. Common-Mode, 3.3 V
Figure 6-13 Propagation Delay vs. Common-Mode, 3.3 V
Figure 6-15 Propagation Delay vs. Overdrive, 3.3 V
Figure 6-17 Propagation Delay vs. Overdrive, 5 V
Figure 6-19 Dispersion vs. Overdrive, 3.3 V
Figure 6-21 Minimum Pulse Width vs. Common-Mode, 3.3 V
Figure 6-4 TLV3801 Hysteresis vs.
Temperature
Figure 6-6 TLV3801 Hysteresis vs.
Common-Mode, 3.3 V
Figure 6-8 TLV3801 Hysteresis vs.
Common-Mode, 5 VFigure 6-10 Supply Current vs. Temperature, Output
High
Figure 6-12 Bias Current vs. Common-Mode, 5 V
Figure 6-14 Propagation Delay vs. Common-Mode, 5 V
Figure 6-16 Propagation Delay vs. Underdrive, 3.3 V
Figure 6-18 Propagation Delay vs. Underdrive, 5 V
Figure 6-20 Dispersion vs. Overdrive, 5 V
Figure 6-22 Minimum Pulse Width vs. Common-Mode, 5 V