SLOS981
October 2019
TLV6003
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
PIR Motion Detector Buffer
Offset Voltage vs Temperature
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information – TLV6003
6.5
Electrical Characteristics
6.6
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Reverse-Battery Protection
7.3.2
Common-Mode Input Range
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.1.1
Drive a Capacitive Load
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Device Support
11.1.1
Development Support
11.2
Documentation Support
11.2.1
Related Documentation
11.3
Receiving Notification of Documentation Updates
11.4
Community Resources
11.5
Trademarks
11.6
Electrostatic Discharge Caution
11.7
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DBV|5
MPDS018S
Thermal pad, mechanical data (Package|Pins)
Orderable Information
slos981_oa
slos981_pm
10.1
Layout Guidelines
Bypass the V
CC
pin to ground with a low ESR capacitor.
The best placement is closest to the V
CC
and ground pins.
Take care to minimize the loop area formed by the bypass capacitor connection between V
CC
and ground.
Connect the ground pin to the PCB ground plane at the pin of the device.
Place the feedback components as close as possible to the device to minimize strays.