SBVS481 November   2025 TLV777

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Switching Characteristics
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Dropout Voltage
      2. 6.3.2 Active Discharge
      3. 6.3.3 Foldback Current Limit
      4. 6.3.4 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Recommended Capacitor Types
      2. 7.1.2 Input and Output Capacitor Requirements
    2. 7.2 Typical Application
      1. 7.2.1 Application
      2. 7.2.2 Design Requirements
      3. 7.2.3 Detailed Design Procedure
      4. 7.2.4 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Typical Characteristics

at operating temperature TJ = 25°C, VIN = VOUT(NOM) + 0.5V, IOUT = 1mA, VEN = VIN, and CIN = COUT = 1μF (unless otherwise noted)

TLV777 Line Regulation vs VIN
 
Figure 5-1 Line Regulation vs VIN
TLV777 Output Voltage Accuracy vs VIN
 
Figure 5-3 Output Voltage Accuracy vs VIN
TLV777 Dropout Voltage vs IOUT
VOUT = 1.8V, Test condition: VIN = VOUT(NOM)
Figure 5-5 Dropout Voltage vs IOUT
TLV777 Ground Current vs IOUT
 
Figure 5-7 Ground Current vs IOUT
TLV777 Shutdown Current vs VIN
VEN = 0V, CIN= 0μF
Figure 5-9 Shutdown Current vs VIN
TLV777 Enable Logic Threshold vs Temperature
 
Figure 5-11 Enable Logic Threshold vs Temperature
TLV777 Load
                        Transient
VOUT = 3.3V, VIN = VOUT(nom) + 1.0V, IOUT = 0mA to 1A to 0mA,
TRISING = TFALLING = 10µs
Figure 5-13 Load Transient
TLV777 PSRR
                        vs Frequency
VIN = VOUT(nom) + 1.0V
Figure 5-15 PSRR vs Frequency
TLV777 Noise
VOUT = 1.8V, RMS Noise BW = 10Hz to 100kHz
Figure 5-17 Noise
TLV777 Load
                        Regulation vs IOUT
 
Figure 5-2 Load Regulation vs IOUT
TLV777 Output Voltage Accuracy vs IOUT
 
Figure 5-4 Output Voltage Accuracy vs IOUT
TLV777 Quiescent Current vs VIN
Figure 5-6 Quiescent Current vs VIN
TLV777 Shutdown Current vs VIN
VEN = 0V, CIN= 0μF
Figure 5-8 Shutdown Current vs VIN
TLV777 Current Limit
 
Figure 5-10 Current Limit
TLV777 Load
                        Transient
VOUT = 1.8V, VIN = VOUT(nom) + 1.0V, IOUT = 0mA to 1A to 0mA,
TRISING = TFALLING = 10µs
Figure 5-12 Load Transient
TLV777 Line
                        Transient
VIN = VOUT + 0.3V to VOUT +1.3V
Figure 5-14 Line Transient
TLV777 Start-Up
 
Figure 5-16 Start-Up
TLV777 Noise
VOUT = 3.3V, RMS Noise BW = 10Hz to 100kHz
Figure 5-18 Noise