SNOSDJ6A May   2025  – October 2025 TLV9020L , TLV9022L , TLV9030L , TLV9032L

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
    1. 4.1 Pin Functions: TLV9020L and TLV9030L Single
    2. 4.2 Pin Configurations:TLV9022L and TLV9032L Dual
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information - Single
    5. 5.5 Thermal Information - Dual
    6. 5.6 Electrical Characteristics
    7. 5.7 Switching Characteristics
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
    4. 6.4 Device Functional Modes
      1. 6.4.1 Outputs
        1. 6.4.1.1 TLV902xL Open-Drain Output
        2. 6.4.1.2 TLV903xL Push-Pull Output
      2. 6.4.2 Power-On Reset (POR)
        1. 6.4.2.1 TLV902xL Open Drain Output POR Behavior
        2. 6.4.2.2 TLV903xL Push-Pull Output POR Behavior
      3. 6.4.3 Output Latching
        1. 6.4.3.1 "L1" and "L2" Power-On Options
        2. 6.4.3.2 TLV902xL1 Open-Drain Latch Behavior
        3. 6.4.3.3 TLV902xL2 Open-Drain Latch Behavior
        4. 6.4.3.4 TLV903xL1 Push-Pull Latch Behavior
        5. 6.4.3.5 TLV903xL2 Push-Pull Latch Behavior
        6. 6.4.3.6 Clear (CLR) Input
      4. 6.4.4 Inputs
        1. 6.4.4.1 Rail to Rail Input
        2. 6.4.4.2 Fail-Safe Inputs
        3. 6.4.4.3 Input Protection
        4. 6.4.4.4 Internal Hysteresis
        5. 6.4.4.5 Unused Inputs
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Basic Comparator Definitions
        1. 7.1.1.1 Operation
        2. 7.1.1.2 Propagation Delay
        3. 7.1.1.3 Overdrive Voltage
    2. 7.2 Typical Applications
      1. 7.2.1 Window Comparator
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curve
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.5 Thermal Information - Dual

THERMAL METRIC (1) TLV9022L, TLV9032L UNIT
DGS (VSSOP) RUG (X2QFN)
10 PINS 10 PINS
RqJA Junction-to-ambient thermal resistance - 222.8 °C/W
RqJC(top) Junction-to-case (top) thermal resistance - 94.2 °C/W
RqJB Junction-to-board thermal resistance - 147.1 °C/W
yJT Junction-to-top characterization parameter - 3.4 °C/W
yJB Junction-to-board characterization parameter - 146.4 °C/W
RqJC(bot) Junction-to-case (bottom) thermal resistance - - °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics report.