SBOS966H april   2019  – june 2023 TLV9061-Q1 , TLV9062-Q1 , TLV9064-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Device Comparison Table
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information: TLV9061-Q1
    5. 8.5 Thermal Information: TLV9062-Q1
    6. 8.6 Thermal Information: TLV9064-Q1
    7. 8.7 Electrical Characteristics
    8. 8.8 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Rail-to-Rail Input
      2. 9.3.2 Rail-to-Rail Output
      3. 9.3.3 Overload Recovery
      4. 9.3.4 Shutdown Function
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Low-Side Current Sense Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Typical Comparator Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Input and ESD Protection
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision G (April 2023) to Revision H (June 2023)

  • Changed the status of the 8-PIN TSSOP (PW) packages from: preview to: active Go
  • Updated the format of the Device Information tableGo

Changes from Revision F (January 2023) to Revision G (April 2023)

  • Changed the status of the 5-PIN SC70 (DCK) packages from: preview to: active Go

Changes from Revision E (February 2021) to Revision F (January 2023)

  • Added 5-pin SOT-23 (DBV) and 5-PIN SC70 (DCK) packages to Device Information section.Go
  • Changed the Description (continued) section to include TLV9061-Q1Go
  • Changed the Device Comparison Table to include 5-pin DBV and DCKGo
  • Added 5-pin SOT-23 and SC70 to Pin Configuration and Functions section Go
  • Added 5-pin DBV (SOT-23) and DCK (SC70) to the Thermal Information: TLV9061-Q1 tableGo

Changes from Revision D (October 2020) to Revision E (February 2021)

  • Deleted preview note from SOT-23 (6) package from Device Information section.Go
  • Added separate ESD rating for TLV9061S-Q1 in ESD Ratings tableGo
  • Updated DBV (SOT-23) thermal information in Thermal Information: TLV9061S-Q1 tableGo

Changes from Revision C (September 2020) to Revision D (October 2020)

  • Added TLV9061-Q1 GPN throughout the data sheetGo

Changes from Revision B (September 2020) to Revision C (September 2020)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Functional Safety-Capable document link added in the Features section.Go
  • Added note 5 to differential input voltage in Absolute Maximum Ratings table.Go

Changes from Revision A (March 2020) to Revision B (September 2020)

  • Deleted preview note from VSSOP (8) and TSSOP (14) package from Device Information section.Go
  • Added thermal information for VSSOP (8) package in Thermal Information section.Go
  • Added thermal information for TSSOP (14) package in Thermal Information section.Go

Changes from Revision * (April 2019) to Revision A (March 2020)

  • First public release of data sheet Go