The TLV9062-Q1 (dual), and TLV9064-Q1 (quad) are dual-, and quad- low-voltage (1.8 V to 5.5 V) operational amplifiers (op amps) with rail-to-rail input- and output-swing capabilities. These devices are cost-effective solutions for automotive applications where low-voltage operation, a small footprint, and high capacitive load drive are required. Although the capacitive load drive of the TLV906x-Q1 is 100 pF, the resistive open-loop output impedance makes stabilizing with higher capacitive loads simpler. These op amps are designed specifically for low-voltage operation (1.8 V to 5.5 V) with performance specifications similar to the OPAx316 and TLVx316 devices, and identical to their non-automotive qualified TLV906x counterparts.
The TLV906x-Q1 family of devices serve as general-purpose automotive amplifiers, for use in low-voltage systems requiring low noise and/or wide bandwidth.
The TLV906x-Q1 family helps simplify system design, because the family is unity-gain stable, integrates the RFI and EMI rejection filter, and provides no phase reversal in overdrive condition.
These devices are available in both dual (TLV9062-Q1), and quad (TLV9064-Q1) versions. Both versions are available in industry standard SOIC, TSSOP packages, with the dual channel also available as a VSSOP.
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Part number | Order | Number of channels (#) | Total supply voltage (Min) (+5V=5, +/-5V=10) | Total supply voltage (Max) (+5V=5, +/-5V=10) | GBW (Typ) (MHz) | Slew rate (Typ) (V/us) | Rail-to-rail | Vos (offset voltage @ 25 C) (Max) (mV) | Iq per channel (Typ) (mA) | Vn at 1 kHz (Typ) (nV/rtHz) | Rating | Operating temperature range (C) | Package Group | Package size: mm2:W x L (PKG) | Offset drift (Typ) (uV/C) | Features | CMRR (Typ) (dB) | Output current (Typ) (mA) | Architecture |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
TLV9062-Q1 |
|
2 | 1.8 | 5.5 | 10 | 6.5 |
In
Out |
1.6 | 0.75 | 16 | Automotive | -40 to 125 | SOIC | 8 | 8SOIC: 19 mm2: 3.91 x 4.9 (SOIC | 8) | 0.53 |
Cost Optimized
EMI Hardened |
103 | 50 | CMOS |
TLV9064-Q1 |
|
4 | 1.8 | 5.5 | 10 | 6.5 |
In
Out |
1.6 | 0.538 | 16 | Automotive | -40 to 125 | SOIC | 14 | 14SOIC: 52 mm2: 6 x 8.65 (SOIC | 14) | 0.53 |
Cost Optimized
EMI Hardened |
103 | 50 | CMOS |