SBOS966H april   2019  – june 2023 TLV9061-Q1 , TLV9062-Q1 , TLV9064-Q1

PRODMIX  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Description (continued)
  7. 6 Device Comparison Table
  8. 7 Pin Configuration and Functions
  9. 8 Specifications
    1. 8.1 Absolute Maximum Ratings
    2. 8.2 ESD Ratings
    3. 8.3 Recommended Operating Conditions
    4. 8.4 Thermal Information: TLV9061-Q1
    5. 8.5 Thermal Information: TLV9062-Q1
    6. 8.6 Thermal Information: TLV9064-Q1
    7. 8.7 Electrical Characteristics
    8. 8.8 Typical Characteristics
  10. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Rail-to-Rail Input
      2. 9.3.2 Rail-to-Rail Output
      3. 9.3.3 Overload Recovery
      4. 9.3.4 Shutdown Function
    4. 9.4 Device Functional Modes
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Typical Low-Side Current Sense Application
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curve
      2. 10.2.2 Typical Comparator Application
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curves
    3. 10.3 Power Supply Recommendations
      1. 10.3.1 Input and ESD Protection
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2 ESD Ratings

VALUEUNIT
TLV9061S-Q1 PACKAGES
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 ±1500
ALL OTHER PACKAGES
V(ESD)Electrostatic dischargeHuman-body model (HBM), per AEC Q100-002(1)±4000V
Charged-device model (CDM), per AEC Q100-011±1500
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with ANSI/ESDA/JEDEC JS-001 Specification.