SBOSAG0D October   2023  – June 2025 TMCS1133

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Typical Characteristics
      1. 6.10.1 Insulation Characteristics Curves
  8. 7 Parameter Measurement Information
    1. 7.1 Accuracy Parameters
      1. 7.1.1 Sensitivity Error
      2. 7.1.2 Offset Error and Offset Error Drift
      3. 7.1.3 Nonlinearity Error
      4. 7.1.4 Power Supply Rejection Ratio
      5. 7.1.5 Common-Mode Rejection Ratio
      6. 7.1.6 External Magnetic Field Errors
    2. 7.2 Transient Response Parameters
      1. 7.2.1 CMTI, Common-Mode Transient Immunity
    3. 7.3 Safe Operating Area
      1. 7.3.1 Continuous DC or Sinusoidal AC Current
      2. 7.3.2 Repetitive Pulsed Current SOA
      3. 7.3.3 Single Event Current Capability
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Current Input
      2. 8.3.2 Input Isolation
      3. 8.3.3 Ambient Field Rejection
      4. 8.3.4 High-Precision Signal Chain
        1. 8.3.4.1 Temperature Stability
        2. 8.3.4.2 Lifetime and Environmental Stability
      5. 8.3.5 Internal Reference Voltage
      6. 8.3.6 Current-Sensing Measurable Ranges
      7. 8.3.7 Overcurrent Detection
        1. 8.3.7.1 Setting The User Configurable Overcurrent Threshold
          1. 8.3.7.1.1 Setting Overcurrent Threshold Using Power Supply Voltage
          2. 8.3.7.1.2 Setting Overcurrent Threshold Example
        2. 8.3.7.2 Overcurrent Output Response
      8. 8.3.8 Sensor Diagnostics
        1. 8.3.8.1 Thermal Alert
        2. 8.3.8.2 Sensor Alert
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Down Behavior
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Total Error Calculation Examples
        1. 9.1.1.1 Room-Temperature Error Calculations
        2. 9.1.1.2 Full-Temperature Range Error Calculations
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
    2. 10.2 Device Support
      1. 10.2.1 Development Support
    3. 10.3 Documentation Support
      1. 10.3.1 Related Documentation
    4. 10.4 Receiving Notification of Documentation Updates
    5. 10.5 Support Resources
    6. 10.6 Trademarks
    7. 10.7 Electrostatic Discharge Caution
    8. 10.8 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DVG|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision C (February 2025) to Revision D (June 2025)

  • Updated the number formatting for tables, figures, and cross-references throughout the document Go
  • Updated the VIORM in the Insulation Specifications section from 1344V to 1697V peak Go
  • Updated the reinforced isolation working voltage in the Insulation Specifications section from 600V to 950V RMS Go
  • Updated the reinforced isolation working voltage in the Insulation Specifications section from 849V to 1343V DC Go
  • Updated the basic isolation working voltage in the Insulation Specifications section from 950V to 1200V RMS Go
  • Added Power Ratings to the Specifications Go
  • Added Safety-Related Certification to the Specifications Go
  • Added Safety Limiting Values to the Specifications Go
  • Added the Input-Referred Noise Density vs Frequency graph to the Typical Characteristics Go
  • Added the Insulation Characteristics Curves to the Typical Characteristics Go
  • Added the Input Isolation section to Feature Description for clarificationGo

Changes from Revision B (March 2024) to Revision C (February 2025)

  • Updated the number formatting for tables, figures, and cross-references throughout the document Go
  • Added the TMCS1133x9A variant deviceGo
  • Updated typical hysteresis specification on variants TMCS1133x7A and TMCS1133x9A to better reflect actual performanceGo

Changes from Revision A (March 2024) to Revision B (August 2024)

  • Updated the number formatting for tables, figures, and cross-references throughout the document Go

Changes from Revision * (October 2024) to Revision A (March 2024)

  • Updated the number formatting for tables, figures, and cross-references throughout the document Go