SBOSAG0D October 2023 – June 2025 TMCS1133
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
The separation between the input conductor and the Hall sensor die due to the TMCS1133 construction provides inherent galvanic isolation between package pins 1 and 2 on the high-voltage input side, and package pins 3 through 10 on the low-voltage output side. Insulation capability is defined according to certification agency definitions and using industry-standard test methods as defined in Section 6.6. Assessment of device lifetime working voltages follow the IEC 60747-17 standard for basic and reinforced insulation, requiring time-dependent dielectric breakdown (TDDB) data-projection are based on projected failure rates of less than 1 part per million (ppm) for reinforced insulation and less than 1000ppm for basic insulation, and a minimum insulation lifetime of 30 years. For reinforced insulation, the IEC 60747-17 standard also requires additional safety margins of 20% for working voltage, and 50% for insulation lifetime, translating into a minimum required lifetime of 30 years at 800VRMS for the TMCS1133.
Figure 8-2 shows the intrinsic capability of the isolation barrier to withstand high-voltage stress over the lifetime of the device. Based on the TDDB data, the intrinsic capability of these devices is 670VRMS with a lifetime > 20 years. Other factors such as operating environment and pollution degree can further limit the working voltage of the component in an end system.