SBOS854E March   2018  – August 2021 TMP1075

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Device Comparison
  7. Pin Configuration and Functions
  8. Specifications
    1. 8.1  Absolute Maximum Ratings
    2. 8.2  ESD Ratings
    3. 8.3  Recommended Operating Conditions
    4. 8.4  Thermal Information
    5. 8.5  Electrical Characteristics:TMP1075
    6. 8.6  Electrical Characteristics: TMP1075N
    7. 8.7  Timing Requirements:TMP1075
    8. 8.8  Timing Requirements: TMP1075N
    9. 8.9  Switching Characteristics
    10. 8.10 Typical Characteristics
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Digital Temperature Output
      2. 9.3.2 I2C and SMBus Serial Interface
        1. 9.3.2.1  Bus Overview
        2. 9.3.2.2  Serial Bus Address
        3. 9.3.2.3  Pointer Register
          1. 9.3.2.3.1 Pointer Register Byte [reset = 00h]
        4. 9.3.2.4  Writing and Reading to the TMP1075
        5. 9.3.2.5  Operation Mode
          1. 9.3.2.5.1 Receiver Mode
          2. 9.3.2.5.2 Transmitter Mode
        6. 9.3.2.6  SMBus Alert Function
        7. 9.3.2.7  General Call- Reset Function
        8. 9.3.2.8  High-Speed Mode (HS)
        9. 9.3.2.9  Coexists in I3C Mixed Fast Mode
        10. 9.3.2.10 Time-Out Function
      3. 9.3.3 Timing Diagrams
      4. 9.3.4 Two-Wire Timing Diagrams
    4. 9.4 Device Functional Modes
      1. 9.4.1 Shutdown Mode (SD)
      2. 9.4.2 One-Shot Mode (OS)
      3. 9.4.3 Continuous Conversion Mode (CC)
      4. 9.4.4 Thermostat Mode (TM)
        1. 9.4.4.1 Comparator Mode (TM = 0)
        2. 9.4.4.2 Interrupt Mode (TM = 1)
        3. 9.4.4.3 Polarity Mode (POL)
    5. 9.5 Register Map
      1. 9.5.1 Register Descriptions
        1. 9.5.1.1 Temperature Register (address = 00h) [default reset = 0000h]
        2. 9.5.1.2 Configuration Register (address = 01h) [default reset = 00FFh (60A0h TMP1075N)]
        3. 9.5.1.3 Low Limit Register (address = 02h) [default reset = 4B00h]
        4. 9.5.1.4 High Limit Register (address = 03h) [default reset = 5000h]
        5. 9.5.1.5 Device ID Register (address = 0Fh) [default reset = 7500]
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Migrating From the xx75 Device Family
      3. 10.2.3 Application Curve
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Receiving Notification of Documentation Updates
    2. 13.2 Support Resources
    3. 13.3 Trademarks
    4. 13.4 Electrostatic Discharge Caution
    5. 13.5 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Power Supply Recommendations

The TMP1075 D, DGK, and DSG packages operate with a power supply in the range of 1.7 V to 5.5 V (TMP1075N DRL package operates from 1.62 V to 3.6 V). A power-supply bypass capacitor is required for precision and stability. Place this power-supply bypass capacitor as close to the supply and ground pins of the device as possible. A typical value for this supply bypass capacitor is 0.01 μF. Applications with noisy or high-impedance power supplies can require a bigger bypass capacitor to reject power-supply noise.

To minimize device self-heating and improve temperature precision, it is recommended to:

  • Use the minimum supply voltage rail available
  • Avoid communication over I2C bus during ADC conversion
  • Use one-shot mode to minimize power consumption
  • Set I2C signal levels VIL close to ground and VIH above 90% of V+
  • Maintain the I2C bus signals positive edge less than 1 µs by using a pull-up resistor < 10 kΩ
  • Connect the address pins A0 and A1 to either ground or V+