SBOS486I July   2009  – December 2018 TMP303

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      TMP303 Functional Block Diagram
      2.      Typical Trip Threshold Accuracy at -20°C to 125°C
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 HYSTSET0, HYSTSET1 and SOH Functionality
      2. 8.3.2 TMP303 Power Up and Timing
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TMP303 Typical Configuration
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 TMP303 With Switches
      3. 9.2.3 Simple Fan Controller
      4. 9.2.4 Wireless Fixed Temperature Heat Detector
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11.1 Layout Guidelines

Mount the TMP303 to a PCB as shown in Figure 19. For this example the HYSTSET0 and HYSTSET1 pins are connected directly to ground. Connecting these pins to ground configures the device for 1°C hysteresis. The SOH pin is grounded in this layout. Leaving this pin floating has no effect on the behavior of the TMP303.

  • Bypass the VS pin to ground with a low-ESR ceramic bypass capacitor. The typical recommended bypass capacitance is a 0.1-μF ceramic capacitor with a X5R or X7R dielectric. The optimum placement is closest to the VS and GND pins of the device. Take care in minimizing the loop area formed by the bypass-capacitor connection, the VS pin, and the GND pin of the IC. Additional bypass capacitance can be added to compensate for noisy or high-impedance power supplies.
  • The OUT pin is a push-pull, active-high output and does not require a pullup resistor to VS.