SCDS488 December   2025 TMUX2819 , TMUX2821

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Thermal Information
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Source or Drain Continuous Current
    6. 5.6 Source or Drain RMS Current
    7. 5.7 Electrical Characteristics
    8. 5.8 Switching Characteristics
    9. 5.9 Typical Characteristics
  7. 6 Parameter Measurement Information
    1. 6.1  On-Resistance
    2. 6.2  On-Leakage Current
    3. 6.3  Off-Leakage Current
    4. 6.4  Power-Off Leakage Current
    5. 6.5  Propagation Delay
    6. 6.6  tON (VDD) and tOFF (VDD) Time
    7. 6.7  Transition Time
    8. 6.8  Break-Before-Make
    9. 6.9  THD + Noise
    10. 6.10 Power Supply Rejection Ratio (PSRR)
    11. 6.11 Charge Injection
    12. 6.12 Bandwidth
    13. 6.13 Off Isolation
    14. 6.14 Crosstalk
  8. 7 Detailed Description
    1. 7.1 Functional Block Diagram
    2. 7.2 Device Functional Modes
    3. 7.3 Feature Description
      1. 7.3.1 Beyond the Supply
      2. 7.3.2 Bidirectional Operation
      3. 7.3.3 Power-Off Protection
      4. 7.3.4 1.2V and 1.8V Logic Compatible Inputs
      5. 7.3.5 Integrated Pull-Down Resistor on Logic Pins
      6. 7.3.6 Fail-Safe Logic
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Audio Input or Output Switching
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
VDD to GND  Supply voltage –0.5 6 V
VSEL to GND Logic control input pin voltage –0.5 6 V
VS or VD to GND Source or drain voltage (Sx, Dx) to ground -7.5 7.5 V
ISEL Logic control input pin current –30 30 mA
IS or ID (CONT) Source or drain continuous current (Sx, Dx) IDC + 10 %(3) mA
TA Ambient temperature –55 150 °C
Tstg Storage temperature –65 150 °C
TJ Junction temperature 150 °C
Ptot Total power dissipation(4) 750 mW
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute maximum ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional. Operating the device in this manner may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) All voltages are with respect to ground, unless otherwise specified.
(3) Refer to Source or Drain Continuous Current table for IDC specifications.
(4) For WCSP package: Ptot derates linearily above TA = 70°C by 9.4mW/°C.