SLASFI0A July   2026  – October 2026 TMUXHS5212

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 High-Speed Performance Parameters
    7. 5.7 Switching Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Output Enable and Power Savings
      2. 6.3.2 Data Line Biasing
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 USB 3.2/4 Implementation for USB Type-C
    3. 7.3 Systems Examples
      1. 7.3.1 USB4 / TBT 3.0 Demuxing
      2. 7.3.2 DisplayPort Main Link Mux/Demux
      3. 7.3.3 MIPI Camera Serial Interface
    4. 7.4 PCIe Lane Muxing
    5. 7.5 Application Curves
    6. 7.6 Power Supply Recommendations
    7. 7.7 Layout
      1. 7.7.1 Layout Guidelines
      2. 7.7.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Receiving Notification of Documentation Updates
    2. 8.2 Support Resources
    3. 8.3 Trademarks
    4. 8.4 Electrostatic Discharge Caution
    5. 8.5 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
  • DTY|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.6 Power Supply Recommendations

The TMUXHS5212 does not require a power supply sequence. TI, however, recommends that PD is asserted low after the device supply VCC is stable and in specification. TI also recommends to place ample decoupling capacitors at the device VCC near the pin.