SLOS528F July   2009  – April 2017 TPA3110D2

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and F unctions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Characteristics: 24 V
    6. 7.6 DC Characteristics: 12 V
    7. 7.7 AC Characteristics: 24 V
    8. 7.8 AC Characteristics: 12 V
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TPA3110D2 Modulation Scheme
        1. 9.3.1.1 Ferrite Bead Filter Considerations
        2. 9.3.1.2 Efficiency: LC Filter Required With The Traditional Class-D Modulation Scheme
        3. 9.3.1.3 When to Use an Output Filter for EMI Suppression
      2. 9.3.2 Gain Setting Via GAIN0 And GAIN1 Inputs
      3. 9.3.3 Differential Inputs
      4. 9.3.4 PLIMIT
      5. 9.3.5 GVDD Supply
      6. 9.3.6 PBTL Select
      7. 9.3.7 Thermal Protection
      8. 9.3.8 DC Detect
      9. 9.3.9 Short-Circuit Protection and Automatic Recovery Feature
    4. 9.4 Device Functional Modes
      1. 9.4.1 SD Operation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Stereo Class-D Amplifier With BTL Output and Single-Ended Inputs With Power Limiting
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Input Resistance
          2. 10.2.1.2.2 Input Capacitor, CI
          3. 10.2.1.2.3 BSN and BSP Capacitors
          4. 10.2.1.2.4 Using Low-ESR Capacitors
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Stereo Class-D Amplifier With PBTL Output and Single-Ended Input
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling, CS
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Device and Documentation Support

Device Support

Development Support

For the TPA3110D2 TINA-TI Reference Design, see SLAM052

For the TPA3110D2 TINA-TI Spice Model, see SLAM053

Documentation Support

Related Documentation

For related documentation see the following:

  • Application Report, PowerPAD™ Thermally Enhanced Package, SLMA002
  • Application Report, Using Thermal Calculation Tools for Analog Components, SLUA566
  • Application Report, AN-1737 Managing EMI in Class D Audio Applications, SNAA050
  • Application Report, AN-1849 An Audio Amplifier Power Supply Design, SNAA057
  • Application Report, Guidelines for Measuring Audio Power Amplifier Performance, SLOA068
  • User's Guide, TPA3110D2 EVM Audio Amplifier Evaluation Board SLOU263

Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

Trademarks

SpeakerGuard, PowerPAD, E2E are trademarks of Texas Instruments.

All other trademarks are the property of their respective owners.

Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.