SLOS528F July   2009  – April 2017 TPA3110D2

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Device Comparison Table
  6. Pin Configuration and F unctions
  7. Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Characteristics: 24 V
    6. 7.6 DC Characteristics: 12 V
    7. 7.7 AC Characteristics: 24 V
    8. 7.8 AC Characteristics: 12 V
    9. 7.9 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 TPA3110D2 Modulation Scheme
        1. 9.3.1.1 Ferrite Bead Filter Considerations
        2. 9.3.1.2 Efficiency: LC Filter Required With The Traditional Class-D Modulation Scheme
        3. 9.3.1.3 When to Use an Output Filter for EMI Suppression
      2. 9.3.2 Gain Setting Via GAIN0 And GAIN1 Inputs
      3. 9.3.3 Differential Inputs
      4. 9.3.4 PLIMIT
      5. 9.3.5 GVDD Supply
      6. 9.3.6 PBTL Select
      7. 9.3.7 Thermal Protection
      8. 9.3.8 DC Detect
      9. 9.3.9 Short-Circuit Protection and Automatic Recovery Feature
    4. 9.4 Device Functional Modes
      1. 9.4.1 SD Operation
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Applications
      1. 10.2.1 Stereo Class-D Amplifier With BTL Output and Single-Ended Inputs With Power Limiting
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
          1. 10.2.1.2.1 Input Resistance
          2. 10.2.1.2.2 Input Capacitor, CI
          3. 10.2.1.2.3 BSN and BSP Capacitors
          4. 10.2.1.2.4 Using Low-ESR Capacitors
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Stereo Class-D Amplifier With PBTL Output and Single-Ended Input
        1. 10.2.2.1 Design Requirements
        2. 10.2.2.2 Detailed Design Procedure
        3. 10.2.2.3 Application Curve
  11. 11Power Supply Recommendations
    1. 11.1 Power Supply Decoupling, CS
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.