SLLSEH9B October   2013  – July 2016 TPD1S414

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics (EN, ACK Pins)
    6. 6.6  Electrical Characteristics (OVP Circuit)
    7. 6.7  Timing Requirements
    8. 6.8  Switching Characteristics (nFET)
    9. 6.9  Supply Current Consumption
    10. 6.10 Thermal Shutdown Feature
    11. 6.11 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Overvoltage Protection on VBUS_CON up to 30-V DC
      2. 7.3.2 Low RON nFET Switch Supports Host and Charging Mode
      3. 7.3.3 ±15-kV IEC 61000-4-2 Level 4 ESD Protection
      4. 7.3.4 100-V IEC 61000-4-5 µs Surge Protection
      5. 7.3.5 Start-Up and OVP Recovery Delay
      6. 7.3.6 Integrated Input Enable and Status Output Signal
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 VBUS_CON < VUVLO
      2. 7.4.2 VUVLO < VBUS_CON < VOVP
      3. 7.4.3 VBUS_CON > VOVP
      4. 7.4.4 OVP Operation
      5. 7.4.5 Host/OTG Mode
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 USB VBUS Voltage Range
        2. 8.2.2.2 USB VBUS Operating Current
        3. 8.2.2.3 VBUS_CON and VBUS_SYS Capacitance
        4. 8.2.2.4 IEC 61000-4-5 100-V Open-Circuit Surge
      3. 8.2.3 Application Curve
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resource
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YZ|12
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from A Revision (October 2013) to B Revision

  • Added ESD Ratings table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from * Revision (October 2013) to A Revision

  • Changed text in the DESCRIPTION From: TPD1S414 waits 15 ms before turning ON the nFET To: TPD1S414 waits 20 ms before turning ON the nFETGo
  • Deleted Continuous forward current through the FET body diode, IDIODE from the ABSOLUTE MAXIMUM RATINGS tableGo
  • Deleted Peak input current on VBUS_CON pin, IBUS from the ABSOLUTE MAXIMUM RATINGS tableGo
  • Added Voltage on ACK pin to the ABSOLUTE MAXIMUM RATINGS tableGo
  • Added Continuous current on VBUS_CON and VBUS_SYS pins to the RECOMMENDED OPERATING CONDITIONS tableGo
  • Added Continuous forward current through the FET body diode, IDIODE to the RECOMMENDED OPERATING CONDITIONS tableGo
  • Added values to the THERMAL INFORMATION tableGo
  • Changed the IHOST_LEAK MAX value From: 160 To: 200 µA in the SUPPLY CURRENT CONSUMPTION tableGo
  • Deleted graphs: Enabling the Load Switch, Connecting VBUS_CON, and OVP Operation from the TIMING DIAGRAMS sectionGo
  • Changed horizontal axis labeling on Figure 7Go
  • Changed Figure 10Go
  • Added text to the APPLICATION INFORMATION sectionGo