SLVSAC2G August   2010  – June 2021 TPD2EUSB30 , TPD2EUSB30A , TPD4EUSB30

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Signal Range on D+, D- Pins
        2. 8.2.2.2 Operating Frequency
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision F (October 2015) to Revision G (June 2021)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Changed the Pin Functions table to clarify pin order and functionGo

Changes from Revision E (August 2014) to Revision F (October 2015)

  • Moved the storage temperature to the Absolute Maximum Ratings table and updated the Handling Ratings table to an ESD Ratings tableGo
  • Added test condition frequency to capacitance Go

Changes from Revision D (August 2012) to Revision E (July 2014)

  • Added Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go

Changes from Revision C (December 2011) to Revision D (August 2012)

  • Updated Dynamic Resistance value.Go
  • Updated Dynamic Resistance value.Go

Changes from Revision B (July 2011) to Revision C (December 2011)

  • Added Insertion Loss graphic to TYPICAL OPERATING CHARACTERISTICS section.Go

Changes from Revision A (December 2010) to Revision B (July 2011)

  • Changed TOP-SIDE MARKING column in the Ordering Information Table Go

Changes from Revision * (August 2010) to Revision A (December 2010)

  • Added TPS2EUSB30A part to document.Go