TPD2EUSB30A

SOT-9X3 (DRT)

3

1 mm² 1 x 1

Supports USB 3.0 data rates (5 Gbps)
IEC 61000-4-2 ESD protection (level 4 contact)
IEC 61000-4-5 surge protection
- 5 A (8/20 µs)
Low capacitance
- DRT: 0.7 pF (typical)
- DQA: 0.8 pF (typical)
Dynamic resistance: 0.6 Ω (typical)
Space-saving DRT, DQA packages
Flow-through pin mapping

Supports USB 3.0 data rates (5 Gbps)
IEC 61000-4-2 ESD protection (level 4 contact)
IEC 61000-4-5 surge protection
- 5 A (8/20 µs)
Low capacitance
- DRT: 0.7 pF (typical)
- DQA: 0.8 pF (typical)
Dynamic resistance: 0.6 Ω (typical)
Space-saving DRT, DQA packages
Flow-through pin mapping

The TPD2EUSB30, TPD2EUSB30A, and TPD4EUSB30 are 2 and 4 channel Transient Voltage Suppressor (TVS) based Electrostatic Discharge (ESD) protection diode arrays. The TPDxEUSB30/A devices are rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Contact). These devices also offer 5 A (8/20 µs) peak pulse current ratings per IEC 61000-4-5 (Surge) specification.

The TPD2EUSB30A offers low 4.5-V DC break-down voltage. The low capacitance, low break-down voltage, and low dynamic resistance make the TPD2EUSB30A a superior protection device for high-speed differential IOs.

The TPD2EUSB30 and TPD2EUSB30A are offered in space saving DRT (1 mm × 1 mm) package. The TPD4EUSB30 is offered in space saving DQA (2.5 mm × 1.0 mm) package.

The TPD2EUSB30, TPD2EUSB30A, and TPD4EUSB30 are 2 and 4 channel Transient Voltage Suppressor (TVS) based Electrostatic Discharge (ESD) protection diode arrays. The TPDxEUSB30/A devices are rated to dissipate ESD strikes at the maximum level specified in the IEC 61000-4-2 international standard (Contact). These devices also offer 5 A (8/20 µs) peak pulse current ratings per IEC 61000-4-5 (Surge) specification.

The TPD2EUSB30A offers low 4.5-V DC break-down voltage. The low capacitance, low break-down voltage, and low dynamic resistance make the TPD2EUSB30A a superior protection device for high-speed differential IOs.

The TPD2EUSB30 and TPD2EUSB30A are offered in space saving DRT (1 mm × 1 mm) package. The TPD4EUSB30 is offered in space saving DQA (2.5 mm × 1.0 mm) package.

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Technical documentation

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	Type	Title	Date
*	Data sheet	TPDxEUSB30x 2-, 4-Channel ESD Protection for Super-Speed USB 3.0 Interface datasheet (Rev. G)	01 Jun 2021
	User guide	Generic ESD Evaluation Module User's Guide (Rev. A)	27 Sep 2021
	White paper	Designing USB for short-to-battery tolerance in automotive environments	10 Feb 2016
	Application note	ESD Layout Guide	04 Mar 2015
	Analog design journal	Design Considerations for System-Level ESD Circuit Protection	25 Sep 2012
	Application note	Reading and Understanding an ESD Protection Datasheet	19 May 2010

Design & development

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Evaluation board

ESDEVM — Generic ESD Evaluation Module

Texas Instrument's ESDEVM evaluation module allows the evaluation of most of TI's ESD portfolio. The board comes with all traditional ESD footprints in order to be able to test any number of devices. Devices that need to be tested can be soldered onto their respect footprint and then tested. For (...)

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Simulation model

TPD2EUSB30A IBIS Model

SLVM401.ZIP (2 KB) - IBIS Model

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Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)

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TINA-TI — SPICE-based analog simulation program

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)

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参考设计

PMP40496 — 2-cell boost charge system reference design with 5-V USB

This 5-V USB, 2-cell battery boost charger reference design includes a charger system and a 2-cell battery holder with a gauge that can be connected by a cable or work independently. The key components of the charger system include the BQ25883 boost charger, TUSB320LAI Type-C CC logic, (...)

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TIDEP0076 — 3D Machine Vision Reference Design Based on AM572x Processor with DLP® Structured Light

The TIDEP0076 3D machine vision design describes an embedded 3D scanner based on the structured light principle. A digital camera along with a Sitara™ AM57xx processor System on Chip (SoC) is used to capture reflected light patterns from a DLP4500-based projector. Subsquent processing (...)

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TIDEP0046 — Monte-Carlo Simulation on AM57x Using OpenCL for DSP Acceleration Reference Design

TI’s high performance ARM® Cortex®-A15 based AM57x processors also integrate C66x DSPs. These DSPs were designed to handle high signal and data processing tasks that are often required by industrial, automotive and financial applications. The AM57x OpenCL implementation makes it easy (...)

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TIDEP0047 — Power and Thermal Design Considerations Using TI's AM57x Processor Reference Design

This is a reference design based on the AM57x processor and companion TPS659037 power management integrated circuit (PMIC). This design specifically highlights important power and thermal design considerations and techniques for systems designed with AM57x and TPS659037. It includes (...)

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