SLVSBO7O December   2012  – August 2024 TPD1E05U06 , TPD4E05U06 , TPD6E05U06

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1.     Absolute Maximum Ratings
    2. 5.1 ESD Ratings—JEDEC Specification
    3. 5.2 ESD Ratings—IEC Specification
    4.     Recommended Operating Conditions
    5. 5.3 Thermal Information
    6. 5.4 Electrical Characteristics
    7. 5.5 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 ±15-kV IEC61000-4-2 Level 4 ESD Protection
      2. 6.3.2 IEC61000-4-4 EFT Protection
      3. 6.3.3 IEC61000-4-5 Surge Protection
      4. 6.3.4 I/O Capacitance
      5. 6.3.5 DC Breakdown Voltage
      6. 6.3.6 Ultra-Low Leakage Current
      7. 6.3.7 Low ESD Clamping Voltage
      8. 6.3.8 Industrial Temperature Range
      9. 6.3.9 Easy Flow-Through Routing
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 HDMI 2.0 Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Signal Range on Pin 1, 2, 4, or 5
        3. 7.2.1.3 Application Curves
      2. 7.2.2 HDMI 2.0 Application
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Signal Range
          2. 7.2.2.2.2 Operating Frequency
        3. 7.2.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
        1. 7.4.2.1 TPD4E05U06 Layout Example
        2. 7.4.2.2 TPD1E05U06 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Tape and Reel Information
    2. 10.2 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DQA|10
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Layout Guidelines

  • The optimum placement is as close to the connector as possible.
    • EMI during an ESD event can couple from the trace being struck to other nearby unprotected traces, resulting in early system failures.
    • The PCB designer needs to minimize the possibility of EMI coupling by keeping any unprotected traces away from the protected traces which are between the TVS and the connector.
  • Route the protected traces as straight as possible.
  • Eliminate any sharp corners on the protected traces between the TVS and the connector by using rounded corners with the largest radii possible.
    • Electric fields tend to build up on corners, increasing EMI coupling.