SLVSIF2 July   2025 TPD4S201

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings—JEDEC Specification
    3. 5.3 ESD Ratings—IEC Specification
    4. 5.4 Recommended Operating Conditions
    5. 5.5 Thermal Information
    6. 5.6 Electrical Characteristics
    7. 5.7 Timing Requirements
    8. 5.8 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 4-Channels of Short-to-VBUS Overvoltage Protection (CC1, CC2, SBU1, SBU2 Pins or CC1, CC2, DP, DM Pins): 28-VDC Tolerant
      2. 6.3.2 CC1, CC2 Overvoltage Protection FETs 600-mA Capable for Passing VCONN Power
      3. 6.3.3 CC Dead Battery Resistors Integrated for Handling the Dead Battery Use Case in Mobile Devices
    4. 6.4 Device Functional Modes
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 VBIAS Capacitor Selection
        2. 7.2.2.2 Dead Battery Operation
        3. 7.2.2.3 CC Line Capacitance
        4. 7.2.2.4 Additional ESD Protection on CC and SBU Lines
        5. 7.2.2.5 FLT Pin Operation
        6. 7.2.2.6 How to Connect Unused Pins
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Pin Configuration and Functions

TPD4S201 TPD4S201 RUK Package, 20-Pin QFN Figure 4-1 TPD4S201 RUK Package, 20-Pin QFN
Table 4-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NO. NAME
12 CC1 I/O System side of the CC1 OVP FET. Connect to either CC pin of the CC/PD controller.
11 CC2 I/O System side of the CC2 OVP FET. Connect to either CC pin of the CC/PD controller.
4 C_CC1 I/O Connector side of the CC1 OVP FET. Connect to either CC pin of the USB Type-C connector.
5 C_CC2 I/O Connector side of the CC2 OVP FET. Connect to either CC pin of the USB Type-C connector.
1 C_SBU1 I/O Connector side of the SBU1 OVP FET. Connect to either SBU pin of the USB Type-C connector. Alternatively, connect to either USB2.0 pin of the USB Type-C connector to protect the USB2.0 pins instead of the SBU pins.
2 C_SBU2 I/O Connector side of the SBU2 OVP FET. Connect to either SBU pin of the USB Type-C connector. Alternatively, connect to either USB2.0 pin of the USB Type-C connector to protect the USB2.0 pins instead of the SBU pins.
15 SBU1 I/O System side of the SBU1 OVP FET. Connect to either SBU pin of the SBU MUX. Alternatively, connect to either USB2.0 pin of the USB2.0 Phy when protecting the USB2.0 pins instead of protecting the SBU pins.
14 SBU2 I/O System side of the SBU2 OVP FET. Connect to either SBU pin of the SBU MUX. Alternatively, connect to either USB2.0 pin of the USB2.0 Phy when protecting the USB2.0 pins instead of protecting the SBU pins.
7 RPD_G1 I/O Short to C_CC1 if dead battery resistors are needed. If dead battery resistors are not needed, short pin to GND.
6 RPD_G2 I/O Short to C_CC2 if dead battery resistors are needed. If dead battery resistors are not needed, short pin to GND.
9 FLT O Open drain for fault reporting.
8, 13, 18 GND GND Ground
3 VBIAS P Pin for ESD support capacitor. Place a 0.1-µF capacitor on this pin to ground.
10 VPWR P 2.7V to 4.5V power supply.
20 NC - No connect, leave floating or grounded
19 NC - No connect, leave floating or grounded
16 NC - No connect, leave floating or grounded
17 NC - No connect, leave floating or grounded
- Thermal Pad GND Internally connected to GND. Used as a heatsink. Connect to the PCB GND plane
(1) I = input, O = output, I/O = input and output, GND = ground, P = power