SLVSA01C May   2011  – June 2016 TPS2062-Q1 , TPS2065-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Dissipation Ratings
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Power Switch
      2. 8.3.2 Charge Pump
      3. 8.3.3 Driver
      4. 8.3.4 Enable (ENx for TPS2062-Q1) and (EN for TPS2065-Q1)
      5. 8.3.5 Overcurrent (OCx)
      6. 8.3.6 Current Sense
      7. 8.3.7 Thermal Sense
      8. 8.3.8 Undervoltage Lockout
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Overcurrent
      2. 9.1.2 OC Response
      3. 9.1.3 Undervoltage Lockout (UVLO)
      4. 9.1.4 Universal Serial Bus (USB) Applications
      5. 9.1.5 Host, Self-Powered (SPH), and Bus-Powered Hubs (BPH)
      6. 9.1.6 Low-Power Bus-Powered and High-Power Bus-Powered Functions
      7. 9.1.7 USB Power-Distribution Requirements
      8. 9.1.8 Generic Hot-Plug Applications
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
    3. 11.3 Thermal Considerations
    4. 11.4 Power Dissipation and Junction Temperature
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Related Links
    4. 12.4 Community Resource
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

TPS2062-Q1 DGN Package
8-Pin MSOP-PowerPAD
Top View

Pin Functions: TPS2062-Q1

PINS TYPE DESCRIPTION
NAME NO.
EN1 3 I Enable input, logic low (active low) turns on power switch IN-OUT1
EN2 4 I Enable input, logic low (active low) turns on power switch IN-OUT2
GND 1 GND Ground
IN 2 PWR Supply Input voltage
OC1 8 O Overcurrent, open-drain output, active low, IN-OUT1
OC2 5 O Overcurrent, open-drain output, active low, IN-OUT2
OUT1 7 O Power-switch output, IN-OUT1
OUT2 6 O Power-switch output, IN-OUT2
Thermal Pad — GND Internally connected to GND; used to heat-sink the part to the circuit board ground plane, also calledPowerPAD™ or exposed thermal pad. Must be connected to GND pin.
TPS2065-Q1 DGN Package
8-Pin HVSSOP
Top View

Pin Functions: TPS2065-Q1

PINS TYPE DESCRIPTION
NAME NO.
EN 4 I Enable input, logic high (active high) turns on power switch IN-OUT
GND 1 GND Ground
IN 2, 3 PWR Supply Input voltage
OC 5 O Overcurrent, open-drain output, active low, IN-OUT
OUT 6, 7, 8 O Power-switch output, IN-OUT
Thermal Pad — GND Internally connected to GND; used to heat-sink the part to the circuit board ground plane, also called PowerPAD™ or exposed thermal pad. Must be connected to GND pin.