SLVS841G November   2008  – October 2026 TPS2552 , TPS2552-1 , TPS2553 , TPS2553-1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Overcurrent Conditions
      2. 8.3.2 Reverse-Voltage Protection
      3. 8.3.3 FAULT Response
      4. 8.3.4 Undervoltage Lockout (UVLO)
      5. 8.3.5 ENABLE (EN or EN)
      6. 8.3.6 Thermal Sense
      7. 8.3.7 Quick Output Discharge
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 Programming the Current-Limit Threshold
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Constant-Current vs Latch-Off Operation and Impact on Output Voltage
    2. 9.2 Typical Applications
      1. 9.2.1 Two-Level Current-Limit Circuit
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedures
          1. 9.2.1.2.1 Designing Above a Minimum Current Limit
          2. 9.2.1.2.2 Designing Below a Maximum Current Limit
          3. 9.2.1.2.3 Accounting for Resistor Tolerance
          4. 9.2.1.2.4 Input and Output Capacitance
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Auto-Retry Functionality
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
      3. 9.2.3 Typical Application as USB Power Switch
        1. 9.2.3.1 Design Requirements
          1. 9.2.3.1.1 USB Power-Distribution Requirements
        2. 9.2.3.2 Detailed Design Procedure
          1. 9.2.3.2.1 Universal Serial Bus (USB) Power-Distribution Requirements
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Self-Powered and Bus-Powered Hubs
      2. 9.3.2 Low-Power Bus-Powered and High-Power Bus-Powered Functions
      3. 9.3.3 Power Dissipation and Junction Temperature
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Application and Implementation

Note:

Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes, as well as validating and testing their design implementation to confirm system functionality.