SLVSBR5C December 2012 – June 2015 TPS27082L
For best operational performance of the device, use good PCB layout practices, including:
For higher reliability it is recommended to limit TPS27082L IC’s die junction temperature to less than 125°C. The IC junction temperature is directly proportional to the on-chip power dissipation. Use the following equation to calculate maximum on-chip power dissipation to restrict the die junction temperature target to safe limits:
The package RθJA value under standard conditions on a High-K board is available in Dissipation Ratings. RθJA value depends upon the PCB layout. An external heat sink and/or a cooling mechanism like a cold air fan can help reduce RθJA and thus improving device thermal capability. Refer to TI’s design support web page at www.ti.com/thermal for a general guidance on improving device thermal performance.