SLVSFJ6A November   2020  – June 2026 TPS27SA08

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Summary Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 SNS Timing Characteristics
    8. 6.8 Typical Characteristics
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Protection Mechanisms
        1. 8.3.1.1 Thermal Shutdown
        2. 8.3.1.2 Current Limit
          1. 8.3.1.2.1 Current Limit Foldback
          2. 8.3.1.2.2 Undervoltage Lockout (UVLO)
          3. 8.3.1.2.3 VBB during Short-to-Ground
        3. 8.3.1.3 Energy Limit
        4. 8.3.1.4 Voltage Transients
          1. 8.3.1.4.1 Driving Inductive and Capacitive Loads
        5. 8.3.1.5 Reverse Supply
        6. 8.3.1.6 Fault Event – Timing Diagrams
      2. 8.3.2 Diagnostic Mechanisms
        1. 8.3.2.1 VOUT Short-to-supply and Open-Load
          1. 8.3.2.1.1 Detection With Switch Enabled
          2. 8.3.2.1.2 Detection With Switch Disabled
        2. 8.3.2.2 SNS Output
          1. 8.3.2.2.1 RSNS Value
            1. 8.3.2.2.1.1 High Accuracy Load Current Sense
            2. 8.3.2.2.1.2 SNS Output Filter
        3. 8.3.2.3 ST Pin
        4. 8.3.2.4 Fault Indication and SNS Mux
        5. 8.3.2.5 Resistor Sharing
        6. 8.3.2.6 High-Frequency, Low Duty-Cycle Current Sensing
    4. 8.4 Device Functional Modes
      1. 8.4.1 Off
      2. 8.4.2 Standby
      3. 8.4.3 Diagnostic
      4. 8.4.4 Standby Delay
      5. 8.4.5 Active
      6. 8.4.6 Fault
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Ground Protection Network
      2. 9.1.2 Interface With Microcontroller
      3. 9.1.3 I/O Protection
      4. 9.1.4 Inverse Current
      5. 9.1.5 Loss of GND
      6. 9.1.6 Thermal Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Thermal Considerations
        2. 9.2.2.2 Diagnostics
          1. 9.2.2.2.1 Selecting the RISNS Value
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Related Documentation
    2. 10.2 Trademarks
    3. 10.3 Electrostatic Discharge Caution
    4. 10.4 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1.4 Inverse Current

Inverse current occurs when 0V < VBB < VOUT. In this case, current can flow from VOUT to VBB. A purely resistive load cannot cause inverse current. However, a capacitive or inductive load can cause inverse current. For example, if there is a significant amount of load capacitance and the VBB node has a transient droop, VOUT can be greater than VBB.

TPS27SA08 device does not detect inverse current. When the switch is enabled, inverse current passes through the switch. When the switch is disabled, inverse current can pass through the MOSFET body diode. The device continues operating in the normal manner during an inverse current event.