SGLS228C December   2003  – September 2015 TPS3805H33-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Dissipation Ratings
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 VDD and SENSE Monitoring
      2. 8.3.2 Transient Immunity
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 TPS3803G15-Q1
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 TPS3803-01-Q1
        1. 9.2.2.1 Design Requirements
      3. 9.2.3 TPS3805H33-Q1
        1. 9.2.3.1 Design Requirements
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Examples
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Device Nomenclature
    2. 12.2 Related Links
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DCK|5
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD Supply voltage(2) 7 7 V
Voltage applied to all other pins(2) –0.3 7 V
IOL Maximum low-level output current 5 mA
IOH Maximum high-level output current –5 mA
IIK Input clamp current VI < 0 or VI > VDD ±10 mA
IOK Output clamp current VO < 0 or VO > VDD ±10 mA
PD Continuous total power dissipation See Dissipation Ratings
TA Operating free-air temperature –40 125 °C
Tsolder Soldering temperature 260 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to GND. For reliable operation, the device should not be continuously operated at 7 V for more than t = 1000 h.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per AEC Q100-002(1) ±2000 V
Charged-device model (CDM), per AEC Q100-011 ±1000
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 Recommended Operating Conditions

MIN MAX UNIT
VDD Supply voltage 1.3 6 V
VI Input voltage 0 VDD + 0.3 V
TA Operating free-air temperature –40 125 °C

7.4 Thermal Information

THERMAL METRIC(1) TPS3803x-Q1 TPS3805x-Q1 UNIT
DCK (SC-70)
5 PINS
RθJA Junction-to-ambient thermal resistance 246.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 68.2 °C/W
RθJB Junction-to-board thermal resistance 78.4 °C/W
ψJT Junction-to-top characterization parameter 0.9 °C/W
ψJB Junction-to-board characterization parameter 77.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance N/A °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage (TPS3805 only) VDD = 1.5 V, IOH = –0.5 mA 0.8 × VDD V
VDD = 3.3 V, IOH = –1 mA
VDD = 6 V, IOH = –1.5 mA
VOL Low-level output voltage VDD = 1.5 V, IOL = 1 mA 0.3 V
VDD = 3.3 V, IOL = 2 mA
VDD = 6 V, IOL = 3 mA
Power-up reset voltage(1) VIT > 1.5 V, TA = 25°C 0.8 V
VIT ≤ 1.5 V, TA = 25°C 1
VIT Negative-going input threshold voltage(2) SENSE 1.2 1.226 1.244 V
TPS3803G15 1.379 1.4 1.421
TPS3805H33 3.004 3.05 3.096
Vhys Hysteresis 1.2 V < VIT < 2.5 V 15 mV
2.5 V < VIT < 3.5 V 30
II Input current SENSE –25 25 nA
IOH High-level output current at RESET Open drain only VDD = VIT + 0.2 V, VOH = VDD 300 nA
IDD Supply current TPS3803-01 VDD = 3.3 V, Output unconnected 2 4 μA
TPS3805, TPS3803G15 3 5
TPS3803-01 VDD = 6 V, Output unconnected 2 4
TPS3805, TPS3803G15 4 6
CI Input capacitance VI = 0 V to VDD 1 pF
(1) The lowest supply voltage at which RESET (VOL(max) = 0.2 V, IOL = 50 μA) becomes active. tr(VDD) ≥ 15 μs/V.
(2) To ensure the best stability of the threshold voltage, place a bypass capacitor (ceramic, 0.1-μF) near the supply terminals.

7.6 Timing Requirements

RL = 1 MΩ, CL = 50 pF, TA = –40°C to 125°C (unless otherwise noted)
MIN MAX UNIT
tw Pulse duration VDD VIH = 1.05 × VIT, VIL = 0.95 × VIT 5.5 μs
SENSE

7.7 Switching Characteristics

RL = 1 MΩ, CL = 50 pF, TA = –40°C to 125°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPHL Propagation (delay) time, high-to-low-level output VDD to RESET delay VIH = 1.05 × VIT, VIL = 0.95 × VIT 5 100 μs
SENSE to RESET delay
tPLH Propagation (delay) time, low-to-high-level output VDD to RESET delay VIH = 1.05 × VIT, VIL = 0.95 × VIT 5 100 μs
SENSE to RESET delay μA

7.8 Dissipation Ratings

PACKAGE POWER RATING
TA < 25°C		 DERATING FACTOR
ABOVE TA = 25°C		 POWER RATING
TA = 70°C		 POWER RATING
TA = 85°C
DCK 321 mW 2.6 mW/°C 206 mW 167 mW
TPS3803-01-Q1 TPS3803G15-Q1 TPS3805H33-Q1 timing_req_gls228.gif Figure 1. Timing Requirements

7.9 Typical Characteristics

TPS3803-01-Q1 TPS3803G15-Q1 TPS3805H33-Q1 g_idd_vdd_h33_gls228.gif
Figure 2. TPS3805H33-Q1 Supply Current vs Supply Voltage
TPS3803-01-Q1 TPS3803G15-Q1 TPS3805H33-Q1 g_vol_iol_1p5v_gls228.gif
Figure 4. Low-Level Output Voltage vs Low-Level Output Current
TPS3803-01-Q1 TPS3803G15-Q1 TPS3805H33-Q1 g_vol_iol_6v_gls228.gif
Figure 6. Low-Level Output Voltage vs Low-Level Output Current
TPS3803-01-Q1 TPS3803G15-Q1 TPS3805H33-Q1 g_voh_ioh_h33_3p3v_gls228.gif
Figure 8. TPS3805H33-Q1 High-Level Output Voltage vs High-Level Output Current
TPS3803-01-Q1 TPS3803G15-Q1 TPS3805H33-Q1 g_voh_ioh_h33_6v_gls228.gif
Figure 10. TPS3805H33-Q1 High-Level Output Voltage vs High-Level Output Current
TPS3803-01-Q1 TPS3803G15-Q1 TPS3805H33-Q1 g_vit_ta_d01_gls228.gif
Figure 12. TPS3803-01-Q1 Normalized Input Threshold Voltage vs Free-Air Temperature At Sense
TPS3803-01-Q1 TPS3803G15-Q1 TPS3805H33-Q1 g_idd_vdd_01_gls228.gif
Figure 3. TPS3803-01-Q1 Supply Current vs Supply Voltage
TPS3803-01-Q1 TPS3803G15-Q1 TPS3805H33-Q1 g_vol_iol_1p5v_exp_gls228.gif
Figure 5. Low-Level Output Voltage vs Low-Level Output Current
TPS3803-01-Q1 TPS3803G15-Q1 TPS3805H33-Q1 g_vol_iol_6v_exp_gls228.gif
Figure 7. Low-Level Output Voltage vs Low-Level Output Current
TPS3803-01-Q1 TPS3803G15-Q1 TPS3805H33-Q1 g_voh_ioh_h33_3p3v_exp_gls228.gif
Figure 9. TPS3805H33-Q1 High-Level Output Voltage vs High-Level Output Current
TPS3803-01-Q1 TPS3803G15-Q1 TPS3805H33-Q1 g_voh_ioh_h33_6v_exp_gls228.gif
Figure 11. TPS3805H33-Q1 High-Level Output Voltage vs High-Level Output Current