SLUSC63A November 2015 – December 2015 TPS53317A
Stable power supply operation depends on proper layout. Follow these guidelines for an optimized PCB layout.
Proper mounting technique adequately covers the exposed thermal tab with solder. Excessive heat during the reflow process can affect electrical performance. Figure 43 shows the recommended reflow oven thermal profile. Proper post-assembly cleaning is also critical to device performance. See SLUA271 for more information.
|RAMP UP AND RAMP DOWN|
|rRAMP(up)||Average ramp-up rate, TS(max) to TP||3||°C/s|
|rRAMP(down)||Average ramp-down rate, TP to TS(max)||6||°C/s|
|tS||Pre-heat time, TS(min) to TS(max)||60||180||s|
|tL||Time maintained above liquidus temperature, TL||60||150||s|
|tP||Time maintained within 5 °C of peak temperature, TP||20||40||s|
|t25P||Total time from 25 °C to peak temperature, TP||480||s|