SLVS889C October   2008  – November 2014 TPS54140

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Simplified Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Handling Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed Frequency PWM Control
      2. 8.3.2  Slope Compensation Output Current
      3. 8.3.3  Bootstrap Voltage (BOOT)
      4. 8.3.4  Low Dropout Operation
      5. 8.3.5  Error Amplifier
      6. 8.3.6  Voltage Reference
      7. 8.3.7  Adjusting the Output Voltage
      8. 8.3.8  Enable and Adjusting Undervoltage Lockout
      9. 8.3.9  Slow Start and Tracking Pin (SS/TR)
      10. 8.3.10 Overload-Recovery Circuit
      11. 8.3.11 Sequencing
      12. 8.3.12 Constant Switching Frequency and Timing Resistor (RT/CLK Pin)
      13. 8.3.13 Overcurrent Protection and Frequency Shift
      14. 8.3.14 Selecting the Switching Frequency
      15. 8.3.15 How to Interface to RT/CLK Pin
      16. 8.3.16 Power Good (PWRGD Pin)
      17. 8.3.17 Overvoltage Transient Protection
      18. 8.3.18 Thermal Shutdown
      19. 8.3.19 Small-Signal Model for Loop Response
      20. 8.3.20 Simple Small-Signal Model for Peak-Current Mode Control
      21. 8.3.21 Small-Signal Model for Frequency Compensation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Pulse Skip Eco-mode
      2. 8.4.2 Operation With VIN < 3.5 V
      3. 8.4.3 Operation With EN Control
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1  Selecting the Switching Frequency
        2. 9.2.2.2  Output Inductor Selection (LO)
        3. 9.2.2.3  Output Capacitor
        4. 9.2.2.4  Catch Diode
        5. 9.2.2.5  Input Capacitor
        6. 9.2.2.6  Slow-Start Capacitor
        7. 9.2.2.7  Bootstrap Capacitor Selection
        8. 9.2.2.8  Undervoltage-Lockout Set Point
        9. 9.2.2.9  Output Voltage and Feedback Resistors Selection
        10. 9.2.2.10 Compensation
        11. 9.2.2.11 Power Dissipation Estimate
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
      2. 12.1.2 Development Support
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.1.2 Development Support

For the WEBENCH Software Tool, go to www.TI.com/WEBENCH.

12.2 Documentation Support

12.2.1 Related Documentation

For related documentation see the following:

  • Designing Type III Compensation for Current Mode Step-Down Converters, SLVA352
  • TPS54140EVM-429 1.5-A, SWIFT™ Regulator Evaluation Module, SLVU285

12.3 Trademarks

Eco-mode, PowerPAD are trademarks of Texas Instruments.

WEBENCH is a registered trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.