SLVS845G March   2009  – August 2014 TPS54362-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
      1. 6.8.1 Efficiency Data of Power Supply
      2. 6.8.2 Output Voltage Dropout
      3. 6.8.3 Quiescent and Standby Current
      4. 6.8.4 Reference Voltages
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Input Voltage
      2. 7.3.2  Function Mode
      3. 7.3.3  Output Voltage V(VReg)
      4. 7.3.4  Oscillator Frequency (RT)
      5. 7.3.5  Synchronization (SYNC)
      6. 7.3.6  Enable or Shutdown (EN)
      7. 7.3.7  Reset Delay (Cdly)
      8. 7.3.8  Reset Pin (RST)
      9. 7.3.9  Boost Capacitor (BOOT)
      10. 7.3.10 Soft Start (SS)
      11. 7.3.11 Short-Circuit Protection
      12. 7.3.12 Overcurrent Protection
      13. 7.3.13 Slew Rate Control (Rslew)
      14. 7.3.14 Thermal Shutdown
      15. 7.3.15 Regulation Voltage (VSENSE)
      16. 7.3.16 RESET Threshold (RST_TH)
      17. 7.3.17 Overvoltage Supervisor for V(VReg) (OV_TH)
      18. 7.3.18 Noise Filter on RST_TH and OV_TH Pins
      19. 7.3.19 Output Tolerances Based on Modes of Operation
      20. 7.3.20 Load Regulation and Line Regulation in Hysteretic Mode
      21. 7.3.21 Internal Undervoltage Lockout (UVLO)
      22. 7.3.22 Loop-Control Frequency Compensation
        1. 7.3.22.1 Type III Compensation
      23. 7.3.23 Bode Plot of Converter Gain
    4. 7.4 Device Functional Modes
      1. 7.4.1 Low-Power Mode (LPM)
      2. 7.4.2 Buck-Mode Low-Power-Mode Operation
      3. 7.4.3 External LPM Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Selecting the Switching Frequency
        2. 8.2.2.2  Output Inductor Selection (LO)
        3. 8.2.2.3  Output Capacitor (CO)
        4. 8.2.2.4  Flyback Schottky Diode
        5. 8.2.2.5  Input Capacitor, C(I)
        6. 8.2.2.6  Output Voltage and Feedback Resistor Selection
        7. 8.2.2.7  Overvoltage Resistor Selection
        8. 8.2.2.8  Reset-Threshold Resistor Selection
        9. 8.2.2.9  Low-Power Mode Threshold
        10. 8.2.2.10 Undervoltage Threshold for Low-Power Mode and Load-Transient Operation
        11. 8.2.2.11 Soft-Start Capacitor
        12. 8.2.2.12 Bootstrap Capacitor Selection
        13. 8.2.2.13 Guidelines for Compensation Components
        14. 8.2.2.14 Compensation
          1. 8.2.2.14.1 Calculate the Loop Compensation
          2. 8.2.2.14.2 Power Dissipation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Inductor
      2. 10.1.2 Input Filter Capacitors
      3. 10.1.3 Feedback
      4. 10.1.4 Traces and Ground Plane
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage EN –0.3 60 V
VIN –0.3 60
VReg –0.3 20
LPM –0.3 5.5
OV_TH –0.3 5.5
RST_TH –0.3 5.5
SYNC –0.3 5.5
VSENSE –0.3 5.5
Output voltage BOOT –0.3 65 V
PH –0.3 60
30 ns –2 60
200 ns –1 60
TJ = –40 –0.85 60
TJ = 125 –0.5 60
RT –0.3 5.5 V
RST –0.3 5.5
Rslew –0.3 5.5
Cdly –0.3 8
SS –0.3 8
COMP –0.3 7
TJ Operating virtual junction temperature range –40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range –55 165 °C
V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) –2 2 kV
Charged-device model (CDM), per AEC Q100-011 –750 750 V
(1) AEC Q100-002 indicates HBM stressing is done in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

6.3 Recommended Operating Conditions

over operating free-air temperature (unless otherwise noted)
MIN MAX UNIT
VI Unregulated buck supply input voltage (VIN, EN) 3.6 48 V
V(VReg) Regulator voltage range 0.9 18 V
Power up in low-power mode (LPM) or discontinuous mode (DCM) 0.9 5.5
Logic level inputs (RST, VSENSE, OV_TH, RST_TH, SYNC, RT) 0 5.25 V
Logic level inputs (SS, Cdly, COMP) 0 6.5 V
TJ Operating junction temperature range(1) –40 150 °C
(1) This assumes TA = TJ – Power dissipation × RθJA (junction-to-ambient).

6.4 Thermal Information

THERMAL METRIC(1) TPS54362-Q1 UNIT
PWP
20 PINS
RθJA Junction-to-ambient thermal resistance 43.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 21.4
RθJB Junction-to-board thermal resistance 18.5
ψJT Junction-to-top characterization parameter 0.5
ψJB Junction-to-board characterization parameter 18.3
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.2
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

V(VIN) = 7 V to 48 V, V(EN) = V(VIN), TJ = –40°C to 150°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEST(1)
INPUT POWER SUPPLY
V(VIN) Supply voltage on VIN pin Normal mode–buck mode after initial start-up 3.6 48 V Info
Low-power mode Falling threshold (LPM disabled) 8 V
Rising threshold (LPM activated) 8.5
High-voltage threshold (LPM disabled) 25 27 30
I(q-Normal) Quiescent current, normal mode Open-loop test – maximum duty cycle
V(VIN) = 7 V to 48 V		 5 10 mA PT
I(q-LPM) Quiescent current; low-power mode I(VReg) < 1 mA, V(VIN) = 12 V, TA = 25°C 65 75 μA PT
I(VReg) < 1 mA, V(VIN) = 12 V, –40 < TJ < 150°C 75
I(VReg) < 1 mA, V(VIN) = 24 V, TA = 25°C 85
I(VReg) < 1 mA, V(VIN) = 24 V, –40 < TJ < 150°C 85
I(SD) Shutdown V(EN) = 0 V, device is OFF, TA = –40°C to 125°C,
V(VIN) = 24 V		 10 μA PT
V(EN) = 0 V, device is OFF, TA = 25°C, V(VIN) = 12 V 1 4
TRANSITION TIMES (LOW-POWER AND NORMAL MODES)
td(1) Transition delay from normal mode to low-power mode V(VIN) = 12 V, V(VReg) = 5 V, I(VReg) = 1 A to 1 mA 100 μs CT
td(2) Transition delay from low-power mode to normal mode V(VIN) = 12 V, V(VReg) = 5 V, I(VReg) = 1 mA to 1 A 5 μs CT
SWITCH-MODE SUPPLY (VReg)
V(VReg) Regulator output V(VSENSE) = 0.8-V reference 0.9 18 V Info
V(VSENSE) Feedback voltage V(VReg) = 0.9 V to 18 V, V(VIN) = 7 V to 48 V 0.788 0.8 0.812 V CT
rDS(on) Internal switch resistance Measured across VIN and PH, I(VReg) = 500 mA 500 mΩ PT
I(CL) Switch current limit, cycle-by-cycle V(VIN) = 12 V 4 6 8 A Info
t(ON-Min) Duty-cycle pulse duration (ON) 50 100 150 ns Info
t(OFF-Min) Duty-cycle pulse duration (OFF) 100 200 250 ns Info
f(SW) Switch-mode frequency Set using external resistor on RT pin 0.2 2.2 MHz PT
Accuracy of f(SW) –10% 10% PT
I(Sink) Sink current in start-up condition V(OV_TH) = 0 V, V(VReg) = 10 V 1 mA Info
I(Limit) Sink-current limit 0 V < V(OV_TH) < 0.8 V, V(VReg) = 10 V 80 mA Info
ENABLE (EN)
VIL Low input threshold 0.7 V PT
VIH High input threshold 1.7 V PT
Ilkg Leakage into EN pin A-revision, V(EN) = 60 V 100 135 μA PT
A-revision,, V(EN) = 12 V 8 15
B-revision, V(EN) = 60 V 10
B-revision, V(EN) = 12 V 2
RESET DELAY (Cdly)
IO External capacitor charge current V(EN) = high 1.4 2 2.6 μA PT
VThreshold Switching threshold Output voltage in regulation 2 V PT
LOW-POWER MODE (LPM)
VIL Low input threshold V(VIN) = 12 V 0.7 V PT
VIH High input threshold V(VIN) = 12 V 1.7 V PT
Ilkg Leakage into LPM pin V(LPM) = 5 V 65 95 μA PT
RESET OUTPUT (RST)
V(RST_TH) Reset threshold for RST_TH pin 0.768 0.832 V PT
SOFT START (SS)
I(SS) Soft-start source current 40 50 60 μA PT
SYNCHRONIZATION (SYNC)(2)
VIL(SYNC) Low input threshold 0.7 V PT
VIH(SYNC) High input threshold 1.7 V PT
Ilkg Leakage SYNC = 5 V 65 95 μA PT
Duty(min) Minimum duty cycle 30% CT
Duty(miax) Maximum duty cycle 70% CT
Rslew
I(Rslew) Output current Rslew = 50 kΩ 20 μA CT
Rslew = 10 kΩ 100
OVERVOLTAGE SUPERVISORS (OV_TH)
V(OV_TH) Threshold for OV_TH pin during OV Internal switch is OFF. 0.768 0.832 V PT
Internal pulldown current on OV_TH pin OV_TH = 1 V, V(VReg) = 5 V 70 mA
THERMAL SHUTDOWN
T(SD) Thermal shutdown junction temperature 175 °C CT
T(HYS) Temperature hysteresis 30 °C CT
(1) PT = Production tested; CT = Characterization tested only, not production tested; Info = User information only, not production tested
(2) The SYNC input clock can have a maximum frequency of 2× the programmed clock frequency up to a maximum value of 1.1 MHz.

6.6 Timing Requirements

V(VIN) = 7 V to 48 V, V(EN) = V(VIN), TJ = –40°C to 150°C (unless otherwise noted)
MIN NOM MAX UNIT TEST(1)
SYNCHRONIZATION (SYNC)(2)
t(trans-ItoE) Internal clock to external clock External clock = 1 MHz, V(VIN) = 12 V,
V(VReg) = 5 V		 2.5 μs Info
f(SYNC) Input clock V(VIN) = 12 V, V(VReg) = 5 V,
f(sw) < f(ext) < 2 × f(sw)		 180 2200 kHz CT
RESET OUTPUT (RST)
td(POR) POR delay timer C2 = 4.7 nF 3.6 7 ms PT
td(RSTdly) Filter time 10 20 35 μs PT

6.7 Switching Characteristics

V(VIN) = 7 V to 48 V, V(EN) = V(VIN), TJ = –40°C to 150°C (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT TEST(1)
SYNCHRONIZATION (SYNC)(2)
t(trans-EtoI) External clock to internal clock Remove external clock, V(VIN) = 12 V, V(VReg) = 5 V 32 μs Info

6.8 Typical Characteristics

6.8.1 Efficiency Data of Power Supply

eff_il_lvs845.gif
V(VIN) = 12 V V(VReg) = 5 V f(SW) = 500 kHz
L = 22 µH C4 (output) = 100 µF TA = 25ºC
Figure 1. FET Switching (Slow Slew Rate)
eff3_il_lvs845.gif
V(VReg) = 5 V f(SW) = 500 kHz L = 22 µH
C4 (output) = 100 µF Rslew = 5 kΩ TA = 25ºC
Figure 2. Fast Slew Rate on Switching FET

6.8.2 Output Voltage Dropout

vo_vi_lvs845.gif
V(VReg) = 5 V f(SW) = 500 kHz
Figure 3. Load Current > 100 mA
dov_il_lvs845.gif
V(VReg) = 5 V TA = 25ºC
Figure 5. Output-Voltage Tracking
vo2_vi_lvs845.gif
V(VReg) = 5 V f(SW) = 500 kHz
Figure 4. Load Current < 100 mA

NOTE

Tracking: The input voltage at which the output voltage drops approximately –0.7 V of the regulated voltage or for low input voltages (tracking function) over the load range.

Start: The input voltage required to achieve 5-V regulation on power up with the stated load currents.

6.8.3 Quiescent and Standby Current

qu_ta_lvs845.gif
V(VIN) = 12 V
Figure 6. LPM, Quiescent Current Variation With Temperature
sd_ta_lvs845.gif
V(VIN) = 12 V
Figure 8. Shutdown Current
cur_ta_lvs845.gif
EN = High V(VIN) = 12 V
Figure 10. Current Consumption vs Temperature
qu2_ta_lvs845.gif
V(VIN) = 24 V
Figure 7. LPM, Quiescent Current Variation with Temperature
sd2_ta_lvs845.gif
V(VIN) = 24 V
Figure 9. Shutdown Current

6.8.4 Reference Voltages

iref_ta_lvs845.gif
V(VIN) = 12 V
Figure 11. Internal Reference Voltage
sr_ta_lvs845.gif
Figure 12. Voltage Drop on Rslew for Current Reference