SLVS834B July   2008  – June 2019 TPS5450-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic and Efficiency Curve
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Recommended Operating Conditions
    3. 6.3 Thermal Information
    4. 6.4 Dissipation Ratings
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Oscillator Frequency
      2. 7.3.2  Voltage Reference
      3. 7.3.3  Enable (ENA) and Internal Slow Start
      4. 7.3.4  Undervoltage Lockout (UVLO)
      5. 7.3.5  Output Feedback (VSENSE) and Internal Compensation
      6. 7.3.6  Voltage Feedforward
      7. 7.3.7  Pulse-Width-Modulation (PWM) Control
      8. 7.3.8  Overcurrent Limiting
      9. 7.3.9  Overvoltage Protection
      10. 7.3.10 Thermal Shutdown
  8. 8 Application Information
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Boost Capacitor (BOOT)
        3. 8.2.2.3  Switching Frequency
        4. 8.2.2.4  Input Capacitors
        5. 8.2.2.5  Output Filter Components
          1. 8.2.2.5.1 Inductor Selection
          2. 8.2.2.5.2 Capacitor Selection
        6. 8.2.2.6  Output Voltage Setpoint
        7. 8.2.2.7  Boot Capacitor
        8. 8.2.2.8  Catch Diode
        9. 8.2.2.9  Output Voltage Limitations
        10. 8.2.2.10 Internal Compensation Network
      3. 8.2.3 Application Curves
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Layout Examples
    3. 9.3 Thermal Calculations
  10. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Third-Party Products Disclaimer
    2. 10.2 Development Support
      1. 10.2.1 Custom Design With WEBENCH® Tools
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Community Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Dissipation Ratings(1)(2)

PACKAGE THERMAL IMPEDANCE
JUNCTION-TO-AMBIENT
8-Pin DDA (4-layer board with solder)(3) 30°C/W
(1) Maximum power dissipation may be limited by overcurrent protection.
(2) Power rating at a specific ambient temperature TA should be determined with a junction temperature of 125°C. This is the point where distortion starts to substantially increase. Thermal management of the final PCB should strive to keep the junction temperature at or below 125°C for best performance and long-term reliability. See Thermal Calculations in applications section of this data sheet for more information.
(3) Test board conditions:
  1. 2 in x 1.85 in, 4 layers, 0.062-in (1,57-mm) thickness
  2. 2-oz copper traces located on the top and bottom of the PCB
  3. 2-oz copper ground planes on the two internal layers
  4. Four thermal vias in the PowerPAD area under the device package