SLVSFU1B April   2023  – October 2023 TPS62874-Q1 , TPS62875-Q1 , TPS62876-Q1 , TPS62877-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6.   Device Options
  7. 5 Pin Configuration and Functions
  8. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings - Q100
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Characteristics
    7. 6.7 Typical Characteristics
  9. 7 Parameter Measurement Information
  10. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed-Frequency DCS-Control Topology
      2. 8.3.2  Forced-PWM and Power-Save Modes
      3. 8.3.3  Transient Non-Synchronous Mode (optional)
      4. 8.3.4  Precise Enable
      5. 8.3.5  Start-Up
      6. 8.3.6  Switching Frequency Selection
      7. 8.3.7  Output Voltage Setting
        1. 8.3.7.1 Output Voltage Range
        2. 8.3.7.2 Output Voltage Setpoint
        3. 8.3.7.3 Non-Default Output Voltage Setpoint
        4. 8.3.7.4 Dynamic Voltage Scaling
        5. 8.3.7.5 Droop Compensation
      8. 8.3.8  Compensation (COMP)
      9. 8.3.9  Mode Selection / Clock Synchronization (MODE/SYNC)
      10. 8.3.10 Spread Spectrum Clocking (SSC)
      11. 8.3.11 Output Discharge
      12. 8.3.12 Undervoltage Lockout (UVLO)
      13. 8.3.13 Overvoltage Lockout (OVLO)
      14. 8.3.14 Overcurrent Protection
        1. 8.3.14.1 Cycle-by-Cycle Current Limiting
        2. 8.3.14.2 Hiccup Mode
        3. 8.3.14.3 Current-Limit Mode
      15. 8.3.15 Power Good (PG)
        1. 8.3.15.1 Standalone / Primary Device Behavior
        2. 8.3.15.2 Secondary Device Behavior
      16. 8.3.16 Remote Sense
      17. 8.3.17 Thermal Warning and Shutdown
      18. 8.3.18 Stacked Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
      2. 8.4.2 Undervoltage Lockout
      3. 8.4.3 Standby
      4. 8.4.4 On
    5. 8.5 Programming
      1. 8.5.1 Serial Interface Description
      2. 8.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 8.5.3 HS-Mode Protocol
      4. 8.5.4 I2C Update Sequence
      5. 8.5.5 I2C Register Reset
      6. 8.5.6 Dynamic Voltage Scaling (DVS)
    6. 8.6 Device Registers
  11. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Selecting the Input Capacitors
        3. 9.2.2.3 Selecting the Compensation Resistor
        4. 9.2.2.4 Selecting the Output Capacitors
        5. 9.2.2.5 Selecting the Compensation Capacitor CC
        6. 9.2.2.6 Selecting the Compensation Capacitor CC2
      3. 9.2.3 Application Curves
    3. 9.3 Application Using Two TPS62876-Q1 in a Stacked Configuration
      1. 9.3.1 Design Requirements For Two Stacked Devices
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Selecting the Compensation Resistor
        2. 9.3.2.2 Selecting the Output Capacitors
        3. 9.3.2.3 Selecting the Compensation Capacitor CC
      3. 9.3.3 Application Curves for Two Stacked Devices
    4. 9.4 Application Using Three TPS62876-Q1 in a Stacked Configuration
      1. 9.4.1 Design Requirements For Three Stacked Devices
      2. 9.4.2 Detailed Design Procedure
        1. 9.4.2.1 Selecting the Compensation Resistor
        2. 9.4.2.2 Selecting the Output Capacitors
        3. 9.4.2.3 Selecting the Compensation Capacitor CC
      3. 9.4.3 Application Curves for Three Stacked Devices
    5. 9.5 Best Design Practices
    6. 9.6 Power Supply Recommendations
    7. 9.7 Layout
      1. 9.7.1 Layout Guidelines
      2. 9.7.2 Layout Example
  12. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  13. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.14.2 Hiccup Mode

To enable hiccup operation, make sure that HICCUPEN = 1 in the CONTROL1 register. The HICCUP function is disabled by default.

If hiccup operation is enabled and the high-side switch current exceeds the current limit threshold on 32 consecutive switching cycles, the device:

  • Stops switching for 128 µs, after which it automatically starts switching again (it starts a new soft-start sequence)
  • Sets the HICCUP bit in the STATUS register
  • Pulls the PG pin low. The PG pin stays low until the overload condition goes away and the device can start up correctly and regulate the output voltage. Note that power-good function has a deglitch circuit, which delays the rising edge of the power-good signal by 40 µs (typical).

Hiccup operation continues – in a repeating sequence of 32 cycles in current limit, followed by a pause of 128 µs, followed by a soft-start attempt – for as long as the output overload condition exists.

The device clears the HICCUP bit if you read the STATUS register when the overload condition has been removed.