SLVSFU1B April   2023  – October 2023 TPS62874-Q1 , TPS62875-Q1 , TPS62876-Q1 , TPS62877-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6.   Device Options
  7. 5 Pin Configuration and Functions
  8. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings - Q100
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Interface Timing Characteristics
    7. 6.7 Typical Characteristics
  9. 7 Parameter Measurement Information
  10. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Fixed-Frequency DCS-Control Topology
      2. 8.3.2  Forced-PWM and Power-Save Modes
      3. 8.3.3  Transient Non-Synchronous Mode (optional)
      4. 8.3.4  Precise Enable
      5. 8.3.5  Start-Up
      6. 8.3.6  Switching Frequency Selection
      7. 8.3.7  Output Voltage Setting
        1. 8.3.7.1 Output Voltage Range
        2. 8.3.7.2 Output Voltage Setpoint
        3. 8.3.7.3 Non-Default Output Voltage Setpoint
        4. 8.3.7.4 Dynamic Voltage Scaling
        5. 8.3.7.5 Droop Compensation
      8. 8.3.8  Compensation (COMP)
      9. 8.3.9  Mode Selection / Clock Synchronization (MODE/SYNC)
      10. 8.3.10 Spread Spectrum Clocking (SSC)
      11. 8.3.11 Output Discharge
      12. 8.3.12 Undervoltage Lockout (UVLO)
      13. 8.3.13 Overvoltage Lockout (OVLO)
      14. 8.3.14 Overcurrent Protection
        1. 8.3.14.1 Cycle-by-Cycle Current Limiting
        2. 8.3.14.2 Hiccup Mode
        3. 8.3.14.3 Current-Limit Mode
      15. 8.3.15 Power Good (PG)
        1. 8.3.15.1 Standalone / Primary Device Behavior
        2. 8.3.15.2 Secondary Device Behavior
      16. 8.3.16 Remote Sense
      17. 8.3.17 Thermal Warning and Shutdown
      18. 8.3.18 Stacked Operation
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-On Reset
      2. 8.4.2 Undervoltage Lockout
      3. 8.4.3 Standby
      4. 8.4.4 On
    5. 8.5 Programming
      1. 8.5.1 Serial Interface Description
      2. 8.5.2 Standard-, Fast-, Fast-Mode Plus Protocol
      3. 8.5.3 HS-Mode Protocol
      4. 8.5.4 I2C Update Sequence
      5. 8.5.5 I2C Register Reset
      6. 8.5.6 Dynamic Voltage Scaling (DVS)
    6. 8.6 Device Registers
  11. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection
        2. 9.2.2.2 Selecting the Input Capacitors
        3. 9.2.2.3 Selecting the Compensation Resistor
        4. 9.2.2.4 Selecting the Output Capacitors
        5. 9.2.2.5 Selecting the Compensation Capacitor CC
        6. 9.2.2.6 Selecting the Compensation Capacitor CC2
      3. 9.2.3 Application Curves
    3. 9.3 Application Using Two TPS62876-Q1 in a Stacked Configuration
      1. 9.3.1 Design Requirements For Two Stacked Devices
      2. 9.3.2 Detailed Design Procedure
        1. 9.3.2.1 Selecting the Compensation Resistor
        2. 9.3.2.2 Selecting the Output Capacitors
        3. 9.3.2.3 Selecting the Compensation Capacitor CC
      3. 9.3.3 Application Curves for Two Stacked Devices
    4. 9.4 Application Using Three TPS62876-Q1 in a Stacked Configuration
      1. 9.4.1 Design Requirements For Three Stacked Devices
      2. 9.4.2 Detailed Design Procedure
        1. 9.4.2.1 Selecting the Compensation Resistor
        2. 9.4.2.2 Selecting the Output Capacitors
        3. 9.4.2.3 Selecting the Compensation Capacitor CC
      3. 9.4.3 Application Curves for Three Stacked Devices
    5. 9.5 Best Design Practices
    6. 9.6 Power Supply Recommendations
    7. 9.7 Layout
      1. 9.7.1 Layout Guidelines
      2. 9.7.2 Layout Example
  12. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  13. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.2.2.1 Inductor Selection

The TPS6287x-Q1 devices have been optimized for inductors in the the range 42 nH to 200 nH. If the transient response of the converter is limited by the slew rate of the current in the inductor, using a smaller inductor can improve performance. However, the output ripple current increases as the value of the inductor decreases, and higher output current ripple generates higher output voltage ripple, which adds to the transient over- or undershoot. The optimum configuration for a given application is a trade-off between a number of parameters. We recommend a starting value of 60 nH to 80 nH for typical applications.

The inductor ripple current is given by:

Equation 6. IL(PP)=VOUTVINVIN – VOUTL×fsw
Equation 7. IL(PP)=0.753.33.3 –0.7580×10–9×2.25×106A =3.22 A
Table 9-2 lists a number of inductors suitable for use with this application. This list is not exhaustive, however, and other inductors from other manufacturers may also be suitable.
Table 9-2 Typical Inductors
PART NUMBERINDUCTANCE [µH]CURRENT [A]

DC RESISTANCE

Notes

DIMENSIONS [LxWxH] mmMANUFACTURER
IHSR2525CZ-5A0.056 µH450.38 mΩFor f ≥ 2.25 MHz6.65 × 6.65 × 3Vishay
XEL4030-101ME0.10 µH

22

1.5 mΩFor f ≥ 1.5 MHz4 × 4 × 3.2Coilcraft
7443020100.105 µH

30

0.235 mΩFor f ≥ 1.5 MHz7 × 7 × 4.8

Wurth

XGL5030-161ME0.16 µH

25

1.3 mΩFor f ≥ 1.5 MHz5.3 × 5.5 × 3Coilcraft

744300006

0.06 µH

37

0.22 mΩFor f ≥ 2.25 MHz

8.64 × 6.35 × 4.5

Wurth
CLT32-55N0.055 µH281 mΩFor f ≥ 2.25 MHz2.5 × 3.2 × 2.5TDK
CLT32-42N0.042 µH

28

1 mΩFor f ≥ 2.25 MHz2.5 × 3.2 × 2.5TDK
HPL505032F1060MRD3P0.06 µH340.7 mΩFor f ≥ 2.25 MHz5 × 5 × 3.2TDK

HPL505028F080MRD3P

0.08 µH

34

0.8 mΩFor f ≥ 2.25 MHz5 × 5 × 3.2

TDK