SLVS927F March   2009  – July 2018 TPS65023-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Step-Down Converters, VDCDC1, VDCDC2, and VDCDC3
      2. 8.3.2 Soft Start
      3. 8.3.3 Active Discharge When Disabled
      4. 8.3.4 Power-Good Monitoring
      5. 8.3.5 Low-Dropout Voltage Regulators
      6. 8.3.6 Undervoltage Lockout
    4. 8.4 Device Functional Modes
      1. 8.4.1 VRTC Output and Operation With or Without Backup Battery
      2. 8.4.2 Power-Save Mode Operation (PSM)
      3. 8.4.3 Low-Ripple Mode
      4. 8.4.4 100% Duty-Cycle Low-Dropout Operation
      5. 8.4.5 System Reset and Control Signals
        1. 8.4.5.1 DEFLDO1 and DEFLDO2
        2. 8.4.5.2 Interrupt Management and the INT Pin
    5. 8.5 Programming
      1. 8.5.1 Power-Up Sequencing
      2. 8.5.2 Serial Interface
    6. 8.6 Register Maps
      1. 8.6.1 VERSION Register (address: 00h) Read-Only
      2. 8.6.2 PGOODZ Register (address: 01h) Read-Only
        1. Table 5. PGOODZ Register Field Descriptions
      3. 8.6.3 MASK Register (address: 02h)
      4. 8.6.4 REG_CTRL Register (address: 03h)
        1. Table 6. REG_CTRL Register Field Descriptions
      5. 8.6.5 CON_CTRL Register (address: 04h)
        1. Table 7. CON_CTRL Register Field Descriptions
      6. 8.6.6 CON_CTRL2 Register (address: 05h)
        1. Table 8. CON_CTRL2 Register Field Descriptions
      7. 8.6.7 DEFCORE Register (address: 06h)
        1. Table 9. DEFCORE Register Field Descriptions
      8. 8.6.8 DEFSLEW Register (address: 07h)
        1. Table 10. DEFSLEW Register Field Descriptions
      9. 8.6.9 LDO_CTRL Register (address: 08h)
        1. Table 11. LDO_CTRL Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Reset Condition of DCDC1
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Inductor Selection for the DC-DC Converters
        2. 9.2.2.2 Output Capacitor Selection
        3. 9.2.2.3 Input Capacitor Selection
        4. 9.2.2.4 Output Voltage Selection
        5. 9.2.2.5 VRTC Output
        6. 9.2.2.6 LDO1 and LDO2
        7. 9.2.2.7 TRESPWRON
        8. 9.2.2.8 VCC Filter
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (March 2016) to F Revision

  • Changed the title of the data sheetGo
  • Changed all references of PowerPAD to thermal padGo
  • Changed the units of the current and peak current parameters from V to mA in the Absolute Maximum Ratings tableGo
  • Added the Receiving Notification of Documentation Updates sectionGo

Changes from D Revision (September 2011) to E Revision

  • Added Device Information table, Table of Contents, Revision History section, Pin Configuration and Functions section, Specifications section, ESD Ratings table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed maximum junction temperature from 125°C to 150°CGo