SLVSAQ8G February   2011  – September 2017 TPS65185

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Data Transmission
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Wake-Up and Power-Up Sequencing
      2. 8.3.2  Dependencies Between Rails
      3. 8.3.3  Soft Start
      4. 8.3.4  Active Discharge
      5. 8.3.5  VPOS/VNEG Supply Tracking
      6. 8.3.6  V3P3 Power Switch
      7. 8.3.7  VCOM Adjustment
        1. 8.3.7.1 Kick-Back Voltage Measurement
        2. 8.3.7.2 Storing the VCOM Power-Up Default Value in Memory
      8. 8.3.8  Fault Handling And Recovery
      9. 8.3.9  Power Good Pin
      10. 8.3.10 Interrupt Pin
      11. 8.3.11 Panel Temperature Monitoring
        1. 8.3.11.1 NTC Bias Circuit
        2. 8.3.11.2 Hot, Cold, and Temperature-Change Interrupts
        3. 8.3.11.3 Typical Application of the Temperature Monitor
    4. 8.4 Device Functional Modes
      1. 8.4.1 SLEEP
      2. 8.4.2 STANDBY
      3. 8.4.3 ACTIVE
      4. 8.4.4 Mode Transitions
        1. 8.4.4.1 SLEEP → ACTIVE
        2. 8.4.4.2 SLEEP → STANDBY
        3. 8.4.4.3 STANDBY → ACTIVE
        4. 8.4.4.4 ACTIVE → STANDBY
        5. 8.4.4.5 STANDBY → SLEEP
        6. 8.4.4.6 ACTIVE → SLEEP
    5. 8.5 Programming
      1. 8.5.1 I2C Bus Operation
    6. 8.6 Register Maps
      1. 8.6.1  Thermistor Readout (TMST_VALUE) Register (address = 0x00h) [reset = N/A]
      2. 8.6.2  Enable (ENABLE) Register (address = 0x01h) [reset = 0h]
      3. 8.6.3  Voltage Adjustment (VADJ) Register (address = 0x02h) [reset = 23h]
      4. 8.6.4  VCOM 1 (VCOM1) Register (address = 0x03h) [reset = 7Dh]
      5. 8.6.5  VCOM 2 (VCOM2) Register (address = 0x04h) [reset = 04h]
      6. 8.6.6  Interrupt Enable 1 (INT_EN1) Register (address = 0x05h) [reset = 7Fh]
      7. 8.6.7  Interrupt Enable 2 (INT_EN2) Register (address = 0x06h) [reset = FFh]
      8. 8.6.8  Interrupt 1 (INT1) Register (address = 0x07h) [reset = 0h]
      9. 8.6.9  Interrupt 2 (INT2) Register (address = 0x08h) [reset = N/A]
      10. 8.6.10 Power-Up Sequence 0 (UPSEQ0) Register (address = 0x09h) [reset = E4h]
      11. 8.6.11 Power-Up Sequence 1 (UPSEQ1) Register (address = 0x0Ah) [reset = 55h]
      12. 8.6.12 Power-Down Sequence 0 (DWNSEQ0) Register (address = 0x0Bh) [reset = 1Eh]
      13. 8.6.13 Power-Down Sequence 1 (DWNSEQ1) Register (address = 0x0Ch) [reset = E0h]
      14. 8.6.14 Thermistor 1 (TMST1) Register (address = 0x0Dh) [reset = 20h]
      15. 8.6.15 Thermistor 2 (TMST2) Register (address = 0x0Eh) [reset = 78h]
      16. 8.6.16 Power Good Status (PG) Register (address = 0x0Fh) [reset = 0h]
      17. 8.6.17 Revision and Version Control (REVID) Register (address = 0x10h) [reset = 45h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Documentation Support

12.2.1 Related Documentation

For related documentation see the following:

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document.

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.5 Trademarks

OMAP, E2E are trademarks of Texas Instruments.

Vizplex is a trademark of E Ink Corporation.

E Ink is a registered trademark of E Ink Corporation.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.