SLVSD87C december   2015  – may 2023 TPS65262-2

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Adjusting the Output Voltage
      2. 7.3.2  Enable and Adjusting Undervoltage Lockout
      3. 7.3.3  Soft-Start Time
      4. 7.3.4  Power-Up Sequencing
      5. 7.3.5  V7V Low Dropout Regulator and Bootstrap
      6. 7.3.6  Out-of-Phase Operation
      7. 7.3.7  Output Overvoltage Protection (OVP)
      8. 7.3.8  PSM
      9. 7.3.9  Slope Compensation
      10. 7.3.10 Overcurrent Protection
        1. 7.3.10.1 High-Side MOSFET Overcurrent Protection
        2. 7.3.10.2 Low-Side MOSFET Overcurrent Protection
      11. 7.3.11 Power Good
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation With VIN < 4.5 V (Minimum VIN)
      2. 7.4.2 Operation with EN Control
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Output Inductor Selection
        2. 8.2.2.2 Output Capacitor Selection
        3. 8.2.2.3 Input Capacitor Selection
        4. 8.2.2.4 Loop Compensation
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)TPS65262-2UNIT
RHB (VQFN)
32 PINS
RθJAJunction-to-ambient thermal resistance32°C/W
RθJC(top)Junction-to-case (top) thermal resistance24.2°C/W
RθJBJunction-to-board thermal resistance6.4°C/W
ψJTJunction-to-top characterization parameter0.2°C/W
ψJBJunction-to-board characterization parameter6.4°C/W
RθJc(bot)Junction-to-case (bottom) thermal resistance1.3°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.