SBVS066T December   2005  – April 2025 TPS74401

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Enable, Shutdown
      2. 6.3.2 Power-Good (VQFN Package Only)
      3. 6.3.3 Internal Current Limit
      4. 6.3.4 Thermal Protection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
    5. 6.5 Programming
      1. 6.5.1 Programmable Soft-Start
      2. 6.5.2 Sequencing Requirements
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Input, Output, and Bias Capacitor Requirements
      2. 7.1.2 Transient Response
      3. 7.1.3 Dropout Voltage
      4. 7.1.4 Output Noise
    2. 7.2 Typical Applications
      1. 7.2.1 Setting the TPS74401
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Using an Auxiliary Bias Rail
      3. 7.2.3 Without an Auxiliary Bias
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Power Dissipation
        2. 7.4.1.2 Thermal Considerations
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Documentation Support
      1. 8.1.1 Related Documentation
      2. 8.1.2 Device Nomenclature
    2. 8.2 Device Support
      1. 8.2.1 Development Support
        1. 8.2.1.1 Evaluation Modules
        2. 8.2.1.2 Spice Models
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision S (November 2024) to Revision T (April 2025)

  • Units for the New chip Load Regulation have been fixed to %/mA for 0mA≤ IOUT ≤ 50mA test condition.Go
  • Units for the New chip Load Regulation have been fixed to %/A for 50mA ≤ IOUT ≤ 3A test conditionGo

Changes from Revision R (April 2017) to Revision S (November 2024)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added notation of legacy chip and new chip throughout documentGo
  • Changed Features and Applications sectionsGo
  • Changed the Device Information table to Package Information Go
  • Changed Typical Characteristics section: Identified legacy chip plots and added new chip plotsGo
  • Changed Output Noise sectionGo