SBVS355C June   2019  – May 2022 TPS745-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 TPS745-Q1 Comparison
      2. 7.3.2 Undervoltage Lockout (UVLO)
      3. 7.3.3 Shutdown
      4. 7.3.4 Foldback Current Limit
      5. 7.3.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device Functional Mode Comparison
      2. 7.4.2 Normal Operation
      3. 7.4.3 Dropout Operation
      4. 7.4.4 Disabled
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Adjustable Device Feedback Resistors
      2. 8.1.2 Input and Output Capacitor Selection
      3. 8.1.3 Dropout Voltage
      4. 8.1.4 Exiting Dropout
      5. 8.1.5 Reverse Current
      6. 8.1.6 Power Dissipation (PD)
      7. 8.1.7 Power-Good Function
      8. 8.1.8 Feed-Forward Capacitor (CFF)
      9. 8.1.9 Start-Up Sequencing
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Input Current
        2. 8.2.2.2 Thermal Dissipation
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Support Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.4.1 Device Functional Mode Comparison

The Device Functional Mode Comparison table shows the conditions that lead to the different modes of operation. See the Electrical Characteristics table for parameter values.

Table 7-2 Device Functional Mode Comparison
OPERATING MODE PARAMETER
VIN VEN IOUT TJ
Normal operation VIN > VOUT(nom) + VDO and VIN > VIN(min) VEN > VEN(HI) IOUT < IOUT(max) TJ < TSD(shutdown)
Dropout operation VIN(min) < VIN < VOUT(nom) + VDO VEN > VEN(HI) IOUT < IOUT(max) TJ < TSD(shutdown)
Disabled
(any true condition disables the device)		 VIN < VUVLO VEN < VEN(LOW) Not applicable TJ > TSD(shutdown)