SGLS162J April   2003  – June 2025 TPS793-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagrams
    3. 6.3 Feature Description
      1. 6.3.1 Undervoltage Lockout (UVLO)
      2. 6.3.2 Shutdown
      3. 6.3.3 Foldback Current Limit
      4. 6.3.4 Thermal Protection
      5. 6.3.5 Reverse Current Operation
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Disabled
  8. 7 Application and Implementation
    1. 7.1 Application Information
      1. 7.1.1 Exiting Dropout
    2. 7.2 Typical Application
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 External Capacitor Requirements
        2. 7.2.2.2 Adjustable Operation
          1. 7.2.2.2.1 Adjustable Operation (Legacy Chip)
          2. 7.2.2.2.2 Adjustable Operation (New Chip)
      3. 7.2.3 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 Board Layout Recommendations to Improve PSRR and Noise Performance
        2. 7.4.1.2 Power Dissipation and Junction Temperature
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Evaluation Modules
        2. 8.1.1.2 Spice Models
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision I (March 2016) to Revision J (June 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added new silicon (M3) devices to documentGo
  • Added new chip DBV package (fixed and adjustable versions) to documentGo
  • Changed entire document to identify the features and differences of the legacy chip and new chip and the adjustable and fixed versions of the deviceGo
  • Changed Features, Applications, and Description sectionsGo
  • Changed Description section to match new chip information, deleted legacy chip Output Spectral Noise Density vs Frequency curveGo
  • Deleted Voltage Options tableGo
  • Added new chip curves to Typical Characteristics section to show side-by-side comparison with legacy chip curvesGo
  • Changed Overview sectionGo
  • Changed Functional Block Diagram sectionGo
  • Changed Undervoltage Lockout (UVLO) sectionGo
  • Changed discussion of EN pin in Shutdown sectionGo
  • Changed Foldback Current Limit sectionGo
  • Changed Reverse Current Operation sectionGo
  • Deleted Regulator Protection sectionGo
  • Changed Device Functional Mode Comparison tableGo
  • Deleted (170 μA typically) from low quiescent current discussion in Application Information sectionGo
  • Added Exiting Dropout sectionGo
  • Added Typical Application Circuit (New Chip) figureGo
  • Deleted (Lithium Ion battery) from input voltage row of Design Parameters tableGo
  • Deleted last paragraph of External Capacitor Requirements sectionGo
  • Changed Adjustable Operation section and titleGo
  • Changed Application Curves sectionGo
  • Added new chip information to Device Nomenclature tableGo

Changes from Revision H (January 2013) to Revision I (January 2016)

  • Changed document part numbers to the generic TPS793-Q1 Go
  • Removed the 2.85-V version from the data sheet Go
  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go