SBVS398A December 2021 – September 2022 TPS7A21
PRODUCTION DATA
Refer to the PDF data sheet for device specific package drawings
The DSBGA package requires specific mounting techniques, which are detailed in the AN-1112 DSBGA Wafer Level Chip Scale Package application note. For best results during assembly, alignment ordinals on the PCB can be used to facilitate placement of the DSBGA device.