SBVS372C December   2018  – December 2022 TPS7A25

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  7. 7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Output Enable
      2. 8.3.2 Dropout Voltage
      3. 8.3.3 Current Limit
      4. 8.3.4 Undervoltage Lockout (UVLO)
      5. 8.3.5 Thermal Shutdown
      6. 8.3.6 Power Good
      7. 8.3.7 Active Overshoot Pulldown Circuitry
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device Functional Mode Comparison
      2. 8.4.2 Normal Operation
      3. 8.4.3 Dropout Operation
      4. 8.4.4 Disabled
        1.       Application and Implementation
          1. 9.1 Application Information
            1. 9.1.1 Adjustable Device Feedback Resistors
            2. 9.1.2 Recommended Capacitor Types
            3. 9.1.3 Input and Output Capacitor Requirements
            4. 9.1.4 Reverse Current
            5. 9.1.5 Feed-Forward Capacitor (CFF)
            6. 9.1.6 Power Dissipation (PD)
            7. 9.1.7 Estimating Junction Temperature
            8. 9.1.8 Special Consideration for Line Transients
          2. 9.2 Typical Application
            1. 9.2.1 Design Requirements
            2. 9.2.2 Detailed Design Procedure
              1. 9.2.2.1 Transient Response
              2. 9.2.2.2 Selecting Feedback Divider Resistors
              3. 9.2.2.3 Thermal Dissipation
            3. 9.2.3 Application Curve
          3. 9.3 Power Supply Recommendations
          4. 9.4 Layout
            1. 9.4.1 Layout Guidelines
            2. 9.4.2 Layout Examples
  9. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Device Nomenclature
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  10. 10Mechanical, Packaging, and Orderable Information
    1. 10.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DRV|6
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.6 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.